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MEMS RF switch integrated process

  • US 7,145,213 B1
  • Filed: 07/27/2004
  • Issued: 12/05/2006
  • Est. Priority Date: 05/24/2004
  • Status: Active Grant
First Claim
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1. The partially fabricated low temperature organic photoresist materials-achieved MEMS switch comprising:

  • a plurality of metallic switch elements held captive in melded multiple thin reflow rounding shaped sacrificial layers of said organic photoresist coating materials on an insulting substrate member;

    a dielectric shell enclosure surrounding said metallic switch elements and said melded multiple thin reflow rounding shaped-sacrificial layers on said insulating substrate member;

    a radio frequency transmission line having lengthwise portions extending outside of and inside of said dielectric shell enclosure and including electrical connection with selected of said metallic switch elements inside of said dielectric shell enclosure;

    a plurality of dielectric shell enclosure-traversing aperture paths communicating from outside to inside of said dielectric shell enclosure; and

    a wet photoresist consuming reactant material received within said dielectric shell enclosure through said plurality of dielectric shell enclosure-traversing aperture paths communicating from outside to inside thereof to release said metallic switch elements from said captivity.

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