Selectively configurable probe structures, e.g., for testing microelectronic components

• US 7,145,355 B2
• Filed: 05/19/2005
• Issued: 12/05/2006
• Est. Priority Date: 08/26/2002
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Crump, Brett, Schaeffer, Ralph
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US11/133,850
• Publication Number:
  US 20050206399A1
• Time in Patent Office: 565 Days
• Field of Search: 324754-762, 324/72.1, 324/72.5, 439/482
• US Class Current: 324/750.03
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07392 manipulating each probe element or tip individually
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

Claims

1. A probe card adapted to test a microelectronic component, comprising:

a plurality of probes carried by a base;

a plurality of actuators, each actuator being associated with one of the probes, the actuators being adapted to move the probes laterally from a first relative orientation corresponding to the base and positions of contacts on a microelectronic component at a first temperature to a different second relative orientation corresponding to the base and positions of the contacts at a different second temperature.

2. The probe card of claim 1 wherein each of the actuators comprises a flexor operatively connected to the associated probe and to the base, the flexor changing length to change the position of the associated probe.

3. The probe card of claim 1 wherein each of the actuators comprises a flexor operatively connected to the associated probe and to the base, the flexor being adapted to change length in response to heating of the flexor.

4. The probe card of claim 1 wherein each of the probes comprises a cantilevered wire probe extending beyond an edge of the base.

5. The probe card of claim 1, further comprising a test power circuit coupled to the plurality of probes and adapted to deliver test power to the plurality of probes.

6. The probe card of claim 1 wherein each of the actuators is adapted to selectively move a tip of the associated probe upwardly away form the positions of the contacts.

7. The probe card of claim 1 wherein each of the actuators is adapted to change from the first temperature to the second temperature in response to an applied voltage.

8. The probe card of claim 1 wherein a tip of at least one probe is in contact with at least one of the contacts when the probes are in the first relative orientation.

9. The probe card of claim 1 wherein the probes are not in contact with the contacts when the probes are in the second relative orientation.