Apparatus of antenna with heat slug and its fabricating process

• US 7,145,511 B2
• Filed: 06/10/2005
• Issued: 12/05/2006
• Est. Priority Date: 10/05/2004
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Lu, Zih-Hao, Tang, Chia-Lun, Yeh, Shih-Huang
• Primary Examiner(s): Ho, Tan
• Application Number:
  US11/149,989
• Publication Number:
  US 20060071308A1
• Time in Patent Office: 543 Days
• Field of Search: 343/700.MS, 343/872, 257/734, 361/704, 361/708
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/242 : specially adapted for hand-held use
• CPC Class Codes: H01Q 1/34 : Adaptation for use in or on ships, submarines, buoys or torpedoes for subaqueous use H01Q1/04
• CPC Class Codes: H01Q 9/0421 : with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

An apparatus of antenna with heat slug and its fabricating process are provided, in which the antenna with heat slug can be realized with a single sheet or double sheets of metal. A dual-band antenna module with a mask cover is taken as an example to realize the apparatus. Each single sheet of metal can be achieved by simply cutting and bending a metal plate. Thereby, it is a simple and low-cost fabricating process. In the known fabricating process of integrated circuit, the heat slug and the antenna can be combined in a module at the same step. Therefore, integrating the antenna with heat slug in a fabricating process needs not to develop a new process.

Claims

1. An apparatus of antenna with heat slug, comprising:

a substrate having an upper surface and a lower surface,

a high-frequency circuitry formed on said upper surface of said substrate, said high-frequency circuitry having a signal transmission line therein;

a mask cover formed on said upper surface of said substrate and having the function of heat dissipating;

a metal sheet at least comprising a dual-band antenna module, and said dual-band antenna module being above said mask cover; and

a mold compound encompassing at least said high-frequency circuitry.

2. The apparatus as claimed in claim 1, wherein said dual-band antenna module further comprises an antenna unit, a first path antenna unit working in a high-frequency range, and a second path antenna unit working in a low-frequency range.

3. The apparatus as claimed in claim 2, wherein said mold compound encompass the lower side of said dual-band antenna module and the outer side of said support elements for holding the module in place.

4. The apparatus as claimed in claim 2, wherein said metal sheet further includes an antenna feed metal sheet for electrically connecting to said antenna signal transmission line, and at least two connect metal sheets for connecting said first and second path antenna units and said mask cover.

5. The apparatus as claimed in claim 2, wherein said apparatus arranges another metal sheet to construct said mask cover.

6. The apparatus as claimed in claim 1, wherein said metal sheet further includes said mask cover.

7. The apparatus as claimed in claim 1, wherein said mask cover further includes a heat slug and a plurality of support elements.