MEMS directional sensor system

• US 7,146,014 B2
• Filed: 06/11/2002
• Issued: 12/05/2006
• Est. Priority Date: 06/11/2002
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Hannah, Eric C.
• Primary Examiner(s): Chin, Vivian
• Assistant Examiner(s): KURR, JASON RICHARD
• Application Number:
  US10/167,213
• Publication Number:
  US 20030228025A1
• Time in Patent Office: 1,638 Days
• Field of Search: 381/113, 381/92, 381/91, 381/122, 381/95, 381/58, 381/356, 381111-115, 381/174, 367/118, 367/129, 367123-125
• US Class Current: 381/92
• CPC Class Codes: H04R 3/00 Circuits for transducers , loudspeakers or microphones

Abstract

A MEMS directional sensor system capable of determining direction from a microphone to a sound source over a wide range of frequencies is disclosed. By utilizing a parallel filter bank that relies on a slow wave structure in a MEMS device, such as described herein, a very small microphone, on the order of a few micrometers, can be designed with unsurpassed ability to detect a sound source location.

Claims

1. An apparatus comprising:

a support structure;

at least two MEMS acoustic sensors mounted on the support structure, each of the sensors adapted for receiving an acoustic signal from a source and producing a sensor output signal representative of the received acoustic signal;

a plurality of bandpass acoustic filters coupled between each of the at least two MEMS acoustic sensors, each of the filters having a pass band, the pass bands arranged for delaying sensor output signals by several wavelengths over a predetermined range of frequencies; and

processing circuitry coupled to receive sensor output signals from the at least two MEMS acoustic sensors and to generate a further signal indicative of a directional heading from the sensors to the source.

2. The apparatus of claim 1 wherein the sensor output signal can be sent directly to the processing circuitry by one of the at least two MEMS acoustic sensors, further wherein the sensor output signals delayed by the plurality of bandpass acoustic filters are provided to the processing circuitry by a second of the at least two MEMS acoustic sensors.

3. The apparatus of claim 2 wherein the plurality of bandpass acoustic filters delay a mechanical perturbation from a diaphragm of a first sensor and couple the mechanical perturbation to a diaphragm of a second sensor.

4. The apparatus of claim 3 wherein a capacitance change from the first sensor and second sensor contains information allowing determination of a time delay between direct receipt of an initial pulse on the diaphragm of the first sensor and receipt of the delayed acoustic signal indicative of direct receipt of the initial pulse on the diaphragm of the second sensor, further wherein comparison of the time delay provides a heading in a first plane.

5. The apparatus of claim 4 wherein the acoustic signals delayed by the plurality of bandpass acoustic filters have frequencies ranging from less than 15 Hz up to greater than 20 kHz.

6. The apparatus of claim 4 wherein each successive bandpass acoustic filter is shifted up in frequency by a fraction of an octave from a preceding bandpass acoustic filter.

7. The apparatus of claim 6 wherein each bandpass acoustic filter is shifted up in frequency by ⅓

of an octave from the preceding bandpass acoustic filter.

8. The apparatus of claim 3 wherein the mechanical perturbation of each diaphragm is delayed by between about 10 and 100 microseconds up to one millisecond or more.

9. The apparatus of claim 1 wherein each of the bandpass acoustic filters comprises a MEMS spring and mass mechanism, further wherein the plurality of bandpass acoustic filters is mechanically coupled to the at least two MEMS acoustic sensors with a flexible MEMS device having etched silicon members.

10. The apparatus of claim 1 wherein each of the at least two MEMS acoustic sensors are comprised of a dielectric layer and a conductive layer.

11. The apparatus of claim 10 wherein the at least two MEMS acoustic sensors are capacitive microphones.

12. The apparatus of claim 11 wherein the capacitive microphones are capacitive condenser microphones formed on the support structure by surface micromachining techniques.

13. The apparatus of claim 1 further comprising components coupled to the apparatus and adapted for use in devices selected from the group consisting of a cell phone, robotic guidance system, portable computing device, ultrasonic medical device, video conferencing device, audio conferencing device, security system, sonar system, acoustic space-mapping system and a hearing aid.

14. An apparatus comprising:

a support structure;

four MEMS acoustic sensors in a tetrahedral configuration mounted on the support structure, each of the sensors having a diaphragm and adapted for receiving an acoustic signal from a source and producing a sensor output signal representative of the received acoustic signal;

a plurality of bandpass acoustic filters coupled between each of the four MEMS acoustic sensors, each of the filters having a pass band, the pass bands arranged for delaying sensor output signals by several wavelengths over a predetermined range of frequencies; and

processing circuitry coupled to receive sensor output signals from the four MEMS acoustic sensors and to generate a further signal indicative of a directional heading from the sensors to the source.

15. The apparatus of claim 14 wherein each of the plurality of bandpass acoustic filters delay mechanical perturbations from one of the diaphragms and couple the mechanical perturbations to another diaphragm.

16. The apparatus of claim 15 wherein the directional heading is a three-dimensional sound ray heading accurate to within one to two degrees.

17. The apparatus of claim 16 further comprising a camera coupled to the apparatus.

18. A system comprising:

a support structure;

at least two MEMS acoustic sensors mounted on the support structure, each of the sensors adapted for receiving an acoustic signal from a source and producing a sensor output signal representative of the received acoustic signal;

a plurality of bandpass acoustic filters coupled between each of the at least two MEMS acoustic sensors, each of the filters having a pass band, the pass bands arranged for delaying sensor output signals by several wavelengths over a predetermined range of frequencies;

processing circuitry coupled to receive sensor output signals from the at least two MEMS acoustic sensors and to generate a further signal indicative of a directional heading from the sensors to the source; and

a transceiver coupled to the at least two MEMS acoustic sensors.

19. The apparatus of claim 18 wherein the sensor output signal can be sent directly to the processing circuitry by one of the at least two MEMS acoustic sensors, further wherein the sensor output signals delayed by the plurality of bandpass acoustic filters are provided to the processing circuitry by a second of the at least two MEMS acoustic sensors.

20. The system of claim 18 wherein the transceiver is a cell phone.

21. A method comprising:

detecting acoustic energy from a sound source using at least two MEMS acoustic sensors residing on a support structure, the sound source having frequencies ranging from subsonic to supersonic bandwidths; and

utilizing a slow wave structure in a filter bank coupled to the at least two MEMS acoustic sensors to create a time delay at all frequencies to produce shifted frequencies, further wherein off-frequency filters reject the shifted frequencies; and

processing a signal from the filter bank to determine directional attributes of the acoustic energy.

22. The method of claim 21 wherein the at least two MEMS acoustic sensors are capacitive condenser microphones formed on the support structure with surface micromachining techniques.

23. The method of claim 22 wherein each of the shifted frequencies are a predetermined fraction of an octave.

24. A method comprising:

receiving a first acoustic signal from a sound source with a first MEMS acoustic sensor and a second acoustic signal from the sound source with a second MEMS acoustic sensor;

producing a first sensor electrical output signal representative of the first received acoustic signal in the first MEMS acoustic sensor and a second sensor electrical output signal representative of the second received acoustic signal in the second MEMS acoustic sensor;

sending the first and second sensor electrical output signals directly to a signal processor;

sending the first and second acoustic signals to an array of pass band filters, wherein the first and second acoustic signals are each delayed to produce first and second delayed acoustic signals;

receiving the first delayed acoustic signal with the second MEMS acoustic sensor and the second delayed acoustic signal with the first MEMS acoustic sensor;

in the second MEMS acoustic sensor, producing a second sensor delayed electrical output signal representative of the received first delayed acoustic signal;

in the first MEMS acoustic sensor, producing a first sensor delayed electrical output signal representative of the received second delayed acoustic signal; and

sending the first and second sensor delayed electrical output signals to the signal processor.

25. The method of claim 24 wherein the signal processor provides processed signals to a receiving system wherein direction from the first and second MEMS acoustic sensors to the sound source is determined.

26. The method of claim 24 wherein the first and second MEMS acoustic sensors are MEMS-based capacitive microphones.