Optic semiconductor module and manufacturing method

• US 7,146,106 B2
• Filed: 08/23/2002
• Issued: 12/05/2006
• Est. Priority Date: 08/23/2002
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Park, Chul Woo, Lee, Sang Ho, Yang, Jun Young
• Primary Examiner(s): Tran, Dzung D.
• Application Number:
  US10/227,051
• Publication Number:
  US 20040036135A1
• Time in Patent Office: 1,565 Days
• Field of Search: 398/138, 398163-164, 385/14, 385/37, 385/49
• US Class Current: 398/138
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01S 5/02251 using optical fibres
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches

Abstract

An optic semiconductor package includes a main board of a substantially planar plate shape. The main board includes an aperture therethrough and a plurality of board metal patterns formed at the periphery of the aperture. A package portion is coupled to the main board. The package portion includes a base, a laser diode and a photo detector electrically coupled to the board metal patterns of the main board and bonded to the base. An optical fiber is inserted into the aperture of the main board and disposed adjacent the package portion. The position and tilt of the optical fiber may be adjusted to achieve optimum optical coupling between the optical fiber and the laser diode and the optical fiber and the photo detector. The optical fiber is stably attached to the main board by an adhesive.

Claims

1. An optic semiconductor module comprising:

a main board of an approximately planar plate shape having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;

a package portion coupled to the main board, the package portion comprising;

a laser diode for converting an electric signal to an optical signal;

a photo detector for converting an optical signal to an electric signal, wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns;

a cap type substrate comprising;

a base having inside surfaces defining a space within the base and defining an opening at a lower part of the base;

a plurality of substrate metal patterns formed on first portions of the inside surfaces and an outside surface of the base; and

an adhesive layer interposed between the substrate metal patterns and the first portions of the inside surfaces and the outside surface of the base, wherein the laser diode and the photo detector are bonded to a second portion of the inside surfaces of the base;

a plurality of conductive wires electrically connecting the laser diode and photo detector to the substrate metal patterns;

a glass attached to a perimeter edge of the opening; and

a glass attach material interposed between the glass and the perimeter edge of the opening, wherein the glass and the glass attach material seal the opening; and

an optical fiber inserted into the aperture of the main board, an end of the optical fiber being disposed adjacent to the package portion.

2. The optic semiconductor module as claimed in claim 1, wherein the base of the cap type substrate further comprises:

a planar portion of an approximately planar plate shape formed at an upper part of the base;

a vertical bending portion bent vertically downward at an edge of the planar portion; and

a horizontal bending portion of a prescribed length extending horizontally from a lower part of the vertical bending portion toward the space; and

wherein the substrate metal patterns are formed on inside surfaces of the planar portion, the vertical bending portion, the horizontal bending portion and the outside surface of the horizontal bending portion.

3. The optic semiconductor module as claimed in claim 1, wherein the base is formed using a material selected from the group consisting of metal, ceramic, and thermosetting resin.

4. The optic semiconductor module as claimed in claim 1, wherein the aperture of the main board extends in a straight line through the main board from a top surface of the main board to a bottom surface of the main board, and further comprising:

a fixer attached to the main board at an end of the aperture located at the bottom surface of the main board wherein the fixer attaches the optical fiber to the main board.

5. The optic semiconductor module as claimed in claim 1, wherein the aperture of the main board bends between a top surface of the main board to a side surface of the main board, and further comprising:

a fixer attached to the main board at an end of the aperture located at a side surface of the main board wherein the fixer attaches the optical fiber to the main board.

6. The optic semiconductor module as claimed in claim 1, wherein the main board further comprises:

a depression portion formed at the periphery of the aperture and extending within the main board a predetermined depth from the top surface of the main board, wherein the cap type substrate is coupled with the depression portion;

wherein the plurality of the board metal patterns is formed at a surface of the depression portion; and

wherein the substrate metal patterns are electrically connected to the board metal patterns.

7. The optic semiconductor module as claimed in claim 1, wherein the package portion further comprises a plurality of conductive bumps electrically and mechanically fused to the laser diode and the photo detector.

8. An optic semiconductor module comprising:

a main board of an approximately planar plate shape having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;

a package portion coupled to the main board, the package portion comprising;

a laser diode for converting an electric signal to an optical signal;

a photo detector for converting an optical signal to an electric signal, wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns;

a substrate having a resin layer of an approximately planar plate shape, wherein the laser diode and the photo detector are attached to a bottom surface of the substrate;

a plurality of substrate metal patterns formed at a bottom surface of the resin layer;

a plurality of conductive wires electrically connecting the laser diode and photo detector to the substrate metal patterns;

an insulative layer applied to a surface of the substrate metal patterns;

a dam of a predetermined thickness coupled to a surface of the insulative layer;

a glass attached to the dam; and

a glass attach material between the glass and the dam, wherein the glass attach material, the glass, and the substrate seal the laser diode and the photo detector from an external environment; and

an optical fiber inserted into the aperture of the main board, an end of the optical fiber being disposed adjacent to the package portion.

9. An optic semiconductor module comprising:

a main board of an approximately planar plate shape having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;

a package portion coupled to the main board, the package portion comprising;

a laser diode for converting an electric signal to an optical signal;

a photo detector for converting an optical signal to an electric signal, wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns;

a substrate comprising a resin layer of an approximately planar plate, wherein the laser diode and the photo detector are bonded to a bottom surface of the substrate;

a plurality of substrate metal patterns formed at a bottom surface of the resin layer;

a plurality of leads having first end portions and second end portions, the first end portions passing through the resin layer and being electrically connected to the substrate metal patterns, the second end portions being bent downward from the respective first end portions of the leads;

a plurality of conductive wires electrically connecting the laser diode and photo detector to the substrate metal patterns;

an insulative layer applied to a surface of the substrate metal patterns;

a dam of a predetermined thickness formed at a surface of the insulative layer;

a glass attached to the dam; and

a glass attach material interposed between the glass and the dam, wherein the glass attach material, the glass, and the substrate seal the laser diode and the photo detector from an external environment; and

an optical fiber inserted into the aperture of the main board, an end of the optical fiber being disposed adjacent to the package portion.

10. A method of manufacturing an optic semiconductor module, the method comprising:

providing a cap type substrate comprising a base having inside surfaces defining a space within the base and defining an opening at the lower part of the base;

forming a plurality of substrate metal patterns;

forming an adhesive layer on first portions of the inside surfaces and an outside surface of the base;

attaching the plurality of substrate metal patterns to the first portions of the inside surfaces and the outside surface of the base by means of the adhesive layer;

bonding a laser diode and a photo detector to a second portion of the inside surfaces of the base;

connecting the laser diode and the photo detector to the plurality of substrate metal patterns by means of conductive wires;

positioning a glass within the opening in the lower part of the base;

attaching the glass to a perimeter edge of the opening by means of a glass attach material;

providing a main board of an approximately planar plate shape, the main board having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture; and

electrically connecting the substrate metal patterns of the cap type substrate to the board metal patterns of the main board.

11. The method of manufacturing an optic semiconductor module as claimed in claim 10 further comprising:

providing an optical fiber;

inserting the optical fiber into the aperture; and

attaching the fiber to the main board.

12. The method of manufacturing an optic semiconductor module as claimed in claim 10 further comprising:

providing an optical fiber;

coupling the optical fiber to the aperture; and

attaching the fiber to the main board by a fixing means attached to the main board at an end of the aperture located at the bottom surface of the main board.

13. An optic semiconductor module comprising:

a main board having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;

a package portion coupled to the main board, wherein the package portion comprises;

a cap type substrate comprising;

a base having inside surfaces defining a space within the base and defining an opening at a lower part of the base;

a plurality of substrate metal patterns formed on first portions of the inside surfaces and an outside surface of the base; and

an adhesive layer interposed between the substrate metal patterns and the first portions of the inside surfaces and the outside surface of the base;

a laser diode bonded to the package portion;

a photo detector bonded to the package portion;

wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns;

a glass attached to a perimeter edge of the opening; and

a glass attach material interposed between the glass and the perimeter edge of the opening, wherein the glass and the glass attach material seal the opening.

14. The optic semiconductor module as claimed in claim 13 further comprising:

a plurality of conductive wires electrically connecting the laser diode and photo detector to the substrate metal patterns; and

wherein the laser diode and the photo detector are bonded to a second portion of the inside surfaces of the base.

15. The optic semiconductor module as claimed in claim 13 wherein the space within the base is in a vacuum state.

16. An optic semiconductor module comprising:

a main board having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;

a package portion coupled to the main board, wherein the package portion comprises;

a cap type substrate comprising;

a base having inside surfaces defining a space within the base and defining an opening at a lower part of the base;

a plurality of substrate metal patterns formed on first portions of the inside surfaces and an outside surface of the base; and

an adhesive layer interposed between the substrate metal patterns and the first portions of the inside surfaces and the outside surface of the base;

a laser diode bonded to the package portion;

a photo detector bonded to the package portion; and

wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns, wherein the main board further comprises;

a depression portion formed at the periphery of the aperture and extending within the main board a predetermined depth from the top surface of the main board, wherein the cap type substrate is coupled with the depression portion;

wherein the plurality of the board metal patterns is formed at a surface of the depression portion; and

wherein the substrate metal patterns are electrically connected to the board metal patterns.

17. An optic semiconductor module comprising:

a main board having an aperture therethrough and a plurality of board metal patterns formed at a periphery of the aperture;

a package portion coupled to the main board;

a laser diode bonded to the package portion;

a photo detector bonded to the package portion;

wherein the laser diode and the photo detector are electrically coupled to the main board through the board metal patterns;

a substrate having a resin layer of an approximately planar plate shape, wherein the laser diode and the photo detector are attached to a bottom surface of the substrate;

a plurality of substrate metal patterns formed at a bottom surface of the resin layer;

a plurality of conductive wires electrically connecting the laser diode and photo detector to the substrate metal patterns;

an insulative layer applied to a surface of the substrate metal patterns;

a dam of a predetermined thickness coupled to a surface of the insulative layer;

a glass attached to the dam; and

a glass attach material between the glass and the dam, wherein the glass attach material, the glass, and the substrate seal the laser diode and the photo detector from an external environment.