Thermal interface material with low melting alloy
First Claim
1. A thermal interface composition for transferring heat between a microprocessor and a heat sink, comprising:
- a matrix material which softens at a temperature of about the operating temperature of the microprocessor; and
a low melting alloy in the form of a dispersion in the matrix material substantially free of agglomerated particles, the low melting alloy melting below said temperature at which the matrix material softens, the low melting alloy being a solid at ambient temperature.
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Abstract
A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic composition which softens at about the operating temperature of the heat source. The viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In use, the thermal interface composition flows under pressure between the heat source and the heat sink to make thermal contact between the two. When the heat source is operated and reaches operating temperature, the viscoelastic composition softens and the low melting alloy melts at around the operating temperature to form a highly thermally conductive, generally homogeneous mixture which readily transfers heat to the heat sink.
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Citations
24 Claims
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1. A thermal interface composition for transferring heat between a microprocessor and a heat sink, comprising:
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a matrix material which softens at a temperature of about the operating temperature of the microprocessor; and a low melting alloy in the form of a dispersion in the matrix material substantially free of agglomerated particles, the low melting alloy melting below said temperature at which the matrix material softens, the low melting alloy being a solid at ambient temperature. - View Dependent Claims (2, 12, 13, 14, 15, 16, 17, 18)
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3. A thermal interface composition for transferring heat between a microprocessor and a heat sink, comprising:
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a matrix material which softens at a temperature of about the operating temperature of the microprocessor, the matrix material including a viscoelastic material which undergoes a viscoelastic change at microprocessor operating temperatures; and a low melting alloy in the form of a dispersion in the matrix material substantially free of agglomerated particles, the low melting alloy melting below said temperature at which the matrix material softens.
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4. A thermal interface composition for transferring heat between a heat source and a heat sink, comprising:
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a matrix material which softens at a temperature of about the operating temperature of the heat source, the matrix material including a pressure sensitive adhesive; and a low melting alloy in the form of a dispersion in the matrix material substantially free of agglomerated particles, the low melting alloy melting below said temperature at which the matrix material softens. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11)
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19. A method for forming a thermal interface comprising:
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combining a matrix material with a low melting alloy to form a thermal interface material of low melting alloy dispersed within the matrix material, including; mixing the low melting alloy with the matrix material at a sufficient temperature such that the low melting alloy melts and is dispersed in the form of a fine dispersion throughout the matrix material, the low melting alloy being substantially free of agglomerated particles, and cooling the mixture of low melting alloy and matrix material such that the low melting alloy is dispersed throughout the matrix material as discrete particles; positioning the thermal interface material between a microprocessor and a heat sink, the matrix material being one which softens and remains soft at a softening temperature around the operating temperature of the microprocessor, the low melting alloy being one which melts below the softening temperature; and operating the heat source, whereby the low melting alloy melts and combines with the matrix material to form the thermal interface.
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20. A method of forming a thermal interface material for transferring heat from a microprocessor device to a heat sink, comprising:
mixing a low melting alloy with a matrix material to disperse the low melting alloy in the form of a dispersion throughout the matrix material substantially free of agglomerated particles, the low melting alloy being one which melts at a temperature of between about 30°
C. and about the operating temperature of the microprocessor device, the matrix material comprising a thermoplastic elastomer and plasticizer which softens at a softening temperature around the operating temperature of the microprocessor device to form a generally homogeneous dispersion with the molten low melting alloy, wherein the low melting alloy melts below the softening temperature.- View Dependent Claims (21, 22)
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23. A thermal interface composition which undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source to a heat sink, the composition comprising:
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(A) a viscoelastic composition which softens and remains soft at a temperature of about the operating temperature of the heat source, the viscoelastic composition comprising; (1) a thermoplastic elastomer, (2) a compatible hydrocarbon oil, and (3) a tackifying resin; and (B) a thermally conductive material in the form of a dispersion within the viscoelastic composition substantially free of agglomerated particles, the thermally conductive material having a melting point below said temperature at which the viscoelastic composition softens. - View Dependent Claims (24)
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Specification