×

Method for accelerating the curing of adhesives

  • US 7,147,742 B2
  • Filed: 07/25/2001
  • Issued: 12/12/2006
  • Est. Priority Date: 08/03/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A process for curing a thermoplastic or reactive adhesive composition containing a binder and nanoscale particles having superparamagnetic or piezoelectric properties, comprising applying to the adhesive composition an electrical, magnetic or electromagnetic alternating field to effect heating of the composition wherein:

  • in the case of thermoplastic adhesives, the adhesive composition is heated beyond the softening point of the thermoplastic binder, orin the case of reactive adhesives, the adhesive composition is heated to a temperature at which the binder matrix is crosslinked via the reactive groups of the binder;

    wherein the nanoscale particles have a mean particle size of 3 to 50 nm and the electrical, magnetic or electromagnetic alternating field has a frequency of between 50 kHz and 300 MHz.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×