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Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system

  • US 7,147,749 B2
  • Filed: 09/30/2002
  • Issued: 12/12/2006
  • Est. Priority Date: 09/30/2002
  • Status: Active Grant
First Claim
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1. An upper electrode assembly for a plasma processing system, comprising:

  • an electrode plate comprising a first surface for coupling said upper electrode to an upper assembly, a second surface comprising a plasma surface and a mating surface for mating said electrode plate with said plasma processing system, a peripheral edge, and a plurality of gas injection orifices coupled to said first surface and said second surface;

    a deposition shield attached said electrode plate, said deposition shield comprising a cylindrical wall having an inner surface contiguous with said plasma surface, an outer surface contiguous with said mating surface, and a distal end surface, wherein said distal end surface comprises;

    a distal end mating surface extending radially inward from said outer surface, anda protrusion adjacent to said inner surface and protruding from said distal end mating surface, said protrusion having a distal end lip surface thereon; and

    a protective barrier provided on exposed surfaces of said upper electrode assembly, said exposed surfaces comprising said plasma surface, said inner surface, and said distal end lip surface.

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