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IC chip package structure and underfill process

  • US 7,148,560 B2
  • Filed: 01/25/2005
  • Issued: 12/12/2006
  • Est. Priority Date: 01/25/2005
  • Status: Active Grant
First Claim
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1. An integrated circuit chip structure comprising:

  • a carrier substrate;

    a flip chip provided on said substrate;

    a dam structure provided on said carrier substrate and disposed adjacent to respective corners of said flip chip; and

    an adhesive material provided between said carrier substrate and said flip chip.

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