Integrated power amplifier module with power sensor

• US 7,148,752 B2
• Filed: 07/02/2005
• Issued: 12/12/2006
• Est. Priority Date: 07/19/2002
• Status: Active Grant

• Current Assignee: Micro Mobio Corporation
• Original Assignee: Guan-Wu Wang, Ikuroh Ichitsubo, Weiping Wang
• Inventors: Wang, Weiping, Ichitsubo, Ikuroh, Wang, Guan-Wu
• Primary Examiner(s): Choe, Henry
• Application Number:
  US11/173,741
• Publication Number:
  US 20050264352A1
• Time in Patent Office: 528 Days
• Field of Search: 330/307, 330/129, 330/136, 330/279, 455/126, 455/300, 455/333
• US Class Current: 330/307
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01031 Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/04953 TaN
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H03F 1/0272 : by using a signal derived from the output signal
• CPC Class Codes: H03G 3/3042 : in modulators, frequency-changers, transmitters or power amplifiers transmission power control in bidirectional transmission systems H04W52/04

Abstract

A power amplifier module for amplifying radio frequency signals includes first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module; one or more radio frequency input pads positioned between the first and second corner ground pads; one or more radio frequency output pads positioned between the third and fourth corner ground pads; and one or more power amplifier circuits centrally positioned on the power amplifier module.

Claims

1. An amplifier module for amplifying radio frequency signals, comprising:

first, second, third and fourth ground pads positioned at each corner of the power amplifier module;

one or more radio frequency input pads positioned between the first and second substantially elongated ground pads;

one or more radio frequency output pads positioned between the third and fourth substantially elongated ground pads; and

one or more power amplifier circuits positioned on the power amplifier module, each power amplifier having an input coupled to one radio frequency input pad and an output coupled to one radio frequency output pad.

2. The module of claim 1, further comprising:

one or more radio frequency linear power amplifiers with multiple stages of transistors;

one or more input match circuits coupled to the radio frequency input pads;

one or more output match circuits coupled to the radio frequency output pads;

one or more power sensor circuits coupled to the radio frequency power sense pads; and

one or more bias circuits coupled to the power control pads.

3. The module of claim 1, wherein the power amplifier circuit controls quality of the radio signal output including error vector magnitude (EVM) and spectrum mask for digitally modulated signals.

4. The module of claim 1 wherein the first, second, third and fourth ground pads are elongated.

5. The module of claim 1 wherein the bias circuit is controlled by feedback from the power sensor signal.

6. The module of claim 1, wherein the power amplifier module has an electrically conducting base, comprising a central conductive land on the module to bond with the electrically conductive base of external grounding circuit, said central conductive land connected with the first, second, third and fourth corner ground pads.

7. The module of claim 1, wherein the power amplifier module is encapsulated in a plastic package with dimensions of about 4 millimeters in length, about 4 millimeters in width and about 1 millimeter in height.

8. The module of claim 1, wherein the central conductive land on the bottom side has dimensions of about 2.7 millimeters in length and about 2.7 millimeters in width.

9. The module of claim 1, comprising a central ground pad.

10. The module of claim 1, wherein the radio frequency input pad, the radio frequency output pad, the radio frequency power sense pad, the power supply pad, and the power control pad have dimensions of about 0.6 millimeters in length and about 0.6 millimeters in width.

11. The module of claim 1, wherein the center-to-center distance between the radio frequency the power supply pad, and the power control pad have a dimension of about 1.4 millimeters.

12. The module of claim 1, wherein the distance from the peripheral edges of the power amplifier module to wherein the first, second, third and fourth corner ground pads, the radio frequency input pad, the radio frequency output pad, the radio frequency power sense pad, the power supply pad, and the power control pad is about 0.1 millimeters.

13. The module of claim 1, comprising a substrate being one of:

a lead frame, a low-temperature co-fired ceramic (LTCC) material, a printed circuit board.

14. The module of claim 1, comprising a center ground pad.

15. The module of claim 1, wherein the circuit is operated by a single DC power supply with a voltage ranging from 2 to 5 volts.

16. The module of claim 1, wherein the amplifier is turned ON by with about 2.8 volts applied to the power control pad, and the amplifier is turned OFF with about less than 0.5 volt applied to the power control pad.

17. The module of claim 1, wherein the output of a power sense pad ranges between 0 to about 3 volts.

18. The module of claim 1, wherein the radio frequency is between about 2.4 GHz to about 2.5 GHz.

19. The module of claim 1, wherein the radio frequency is between about 5 GHz to about 6 GHz.

20. A wireless communication device for transmitting and receiving radio frequency signals, comprising:

a) one or more power amplifier modules for amplifying radio frequency signals, comprising;

first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module;

one or more radio frequency input pads positioned between the first and second corner ground pads;

one or more radio frequency output pads positioned between the third and fourth corner ground pads;

one or more power amplifier circuits centrally positioned on the power amplifier module, each power amplifier having an input coupled to one radio frequency input pad and an output coupled to one radio frequency output pad; and

(b) one or more Vmode control pins to control power amplifier characteristics suitable for RF signal modulation for one of;

GSM, GPRS, CDMA, WCDMA, WLAN.