Microcontroller having an on-chip high gain amplifier

• US 7,149,316 B1
• Filed: 06/26/2001
• Issued: 12/12/2006
• Est. Priority Date: 10/26/2000
• Status: Active Grant

• Current Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Kutz, Harold, Mar, Monte
• Primary Examiner(s): WOO, STELLA L
• Application Number:
  US09/893,048
• Time in Patent Office: 1,995 Days
• Field of Search: 381/120, 381/121, 257/204, 257/203, 257/208, 257/209, 700/94, 330/250, 330/251, 330/252, 330/253, 330/277, 330/307, 330/311
• US Class Current: 381/120
• CPC Class Codes: H03F 3/72 Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal

Abstract

A microcontroller includes a wide band, high gain amplifier on-chip capable of driving a 32 ohm speaker. The amplifier is controllable by the microcontroller processor to either enable or disable the amplifier and switch between multiple modes of power. In one embodiment, one or more such amplifiers are situated anywhere on the integrated circuit die including at the corners of the die.

Claims

1. A microcontroller chip, comprising:

a processor for executing program instructions;

an array of configurable circuit blocks configured to perform a circuit function, such circuit blocks configured to produce an analog output signal; and

an on-chip analog amplifier having an input receiving the analog output signal and producing an amplified output signal suitable for driving a loudspeaker external to the microcontroller chip.

2. The apparatus according to claim 1, wherein the microcontroller chip has four corners, and wherein the on-chip analog amplifier is situated adjacent one of the four corners.

3. The apparatus according to claim 1, further comprising a switchable current source for selectively providing an increase in bias current to the on-chip analog amplifier under control of the processor.

4. The apparatus according to claim 1, wherein the on-chip analog amplifier comprises a tristatable CMOS analog amplifier.

5. The apparatus according to claim 4, wherein the CMOS analog amplifier comprises a tristate CMOS analog amplifier.

6. The apparatus according to claim 5, wherein a tristate mode of the tristate CMOS analog amplifier is selectably controlled by the processor.

7. The apparatus according to claim 1, wherein the on-chip analog amplifier produces an amplified output signal suitable for driving a 32 ohm loudspeaker external to the microcontroller chip.

8. The apparatus according to claim 1, wherein the array of configurable circuit blocks comprise an array of analog circuit blocks and an array of digital circuit blocks.

9. The apparatus according to claim 8, further comprising a wirebond pad, and wherein the amplified output signal is directed to an external loudspeaker via the wirebond pad.

10. The apparatus according to claim 9, further comprising switching means coupled to the wirebonding pad that selectively disables a connection between the configurable circuit blocks and the wirebond pad under processor control.

11. A microcontroller chip, comprising:

a processor for executing program instructions;

an array of configurable digital circuit blocks configured to perform a digital circuit function;

an array of configurable analog circuit blocks configured to perform an analog circuit function, such analog circuit blocks configured to produce an analog output signal; and

an on-chip CMOS analog amplifier having an input receiving the analog output signal and producing an amplified output signal suitable for driving a loudspeaker external to the microcontroller chip.

12. The apparatus according to claim 11, wherein the microcontroller chip has four corners, and wherein the on-chip analog amplifier is situated adjacent one of the four corners.

13. The apparatus according to claim 11, further comprising a switchable current source for selectively providing an increase in bias current to the on-chip analog amplifier under control of the processor.

14. The apparatus according to claim 11, wherein the on-chip analog amplifier comprises a CMOS analog amplifier.

15. The apparatus according to claim 14, wherein a tristate mode of the tristate CMOS analog amplifier is selectably controlled by the processor.

16. The apparatus according to claim 11, wherein the on-chip analog amplifier produces an amplified output signal suitable for driving a 32 ohm loudspeaker external to the microcontroller chip.

17. The apparatus according to claim 11, further comprising a wirebond pad, and wherein the amplified output signal is directed to an external loudspeaker via the wirebond pad;

and further comprising switching means coupled to the wirebonding pad that selectively disables a connection between the configurable analog and digital circuit blocks and the wirebond pad under processor control.

18. A microcontroller chip, comprising:

a processor for executing program instructions;

an array of configurable digital circuit blocks configured to perform a digital circuit function;

an array of configurable analog circuit blocks configured to perform an analog circuit function, such analog circuit blocks configured to produce an analog output signal;

an on-chip tristateable CMOS analog amplifier having an input receiving the analog output signal and producing an amplified output signal suitable for driving a loudspeaker external to the microcontroller chip, wherein a tristate mode of the tristate CMOS analog amplifier is selectably controlled by the processor;

a switchable current source for selectively providing an increase in bias current to the on-chip analog amplifier under control of the processor;

wherein the microcontroller chip has four corners, and wherein the on-chip analog amplifier is situated adjacent one of the four corners.

19. The apparatus according to claim 18, further comprising a wirebond pad, and wherein the amplified output signal is directed to an external loudspeaker via the wirebond pad.

20. The apparatus according to claim 19, further comprising switching means coupled to the wirebonding pad that selectively disables a connection between the configurable circuit blocks and the wirebond pad under processor control.