High-frequency module and radio communication apparatus

• US 7,149,496 B2
• Filed: 03/26/2004
• Issued: 12/12/2006
• Est. Priority Date: 03/27/2003
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Fukuoka, Yasuhiko, Iwasaki, Satoru, Fukuyama, Kenta, Ninomiya, Hiroshi, Horiuchi, Masafumi, Nakamata, Katsuro
• Primary Examiner(s): Trinh, Sonny
• Application Number:
  US10/810,492
• Publication Number:
  US 20040203552A1
• Time in Patent Office: 991 Days
• Field of Search: 455/333, 455/73, 455/552.1, 455/550.1, 455/269, 455/323, 330/250, 333/116, 333/247, 257/712, 257/748, 257/724, 257/659, 438/460
• US Class Current: 455/333
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03F 3/245 with semiconductor devices only
• CPC Class Codes: H04B 1/005 adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
• CPC Class Codes: H04B 1/006 : using switches for selecting the desired band H04B1/0057 takes precedence
• CPC Class Codes: H04B 1/406 : with more than one transmission mode, e.g. analog and digital modes
• CPC Class Codes: H04B 1/48 : in circuits for connecting transmitter and receiver to a common transmission path, e.g. by energy of transmitter H04B1/46 takes precedence

Claims