Method and apparatus for accurate on-die temperature measurement
First Claim
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1. A device comprising:
- a processor having a plurality of hotspots during operation, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the respective hotspot;
a plurality of p-n junctions, each within a hotspot of the plurality of hotspots, a junction voltage of each p-n junction to change as a function of temperature of the respective hotspot of the processor;
a first analog multiplexer having inputs connected to the plurality of p-n junctions;
a register to store a temperature code;
a digital-to-analog converter to output an analog signal in accordance with a binary number;
an analog comparator to compare the output from the digital-to-analog converter with an output from the first analog multiplexer, a logic-state transition in an output of the analog comparator to signal the register to store the binary number as the temperature code; and
a digital comparison circuit, to compare the temperature code with a plurality of programmable temperature trip values, the processor to modify processor operation based upon comparison of the temperature code with the plurality of programmable temperature trip values.
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Abstract
A device and method for continually monitoring multiple thermal sensors located at hotspots across a processor. The sensors are connected to a sensor cycling and selection block located at a periphery of the die. The output from the sensor selection block is converted into a digital temperature code. Based on the digital temperature code, thermal events trigger various thermal controls. The thermal event triggers may be software-programmable, providing flexible temperature management.
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Citations
32 Claims
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1. A device comprising:
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a processor having a plurality of hotspots during operation, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the respective hotspot; a plurality of p-n junctions, each within a hotspot of the plurality of hotspots, a junction voltage of each p-n junction to change as a function of temperature of the respective hotspot of the processor; a first analog multiplexer having inputs connected to the plurality of p-n junctions; a register to store a temperature code; a digital-to-analog converter to output an analog signal in accordance with a binary number; an analog comparator to compare the output from the digital-to-analog converter with an output from the first analog multiplexer, a logic-state transition in an output of the analog comparator to signal the register to store the binary number as the temperature code; and a digital comparison circuit, to compare the temperature code with a plurality of programmable temperature trip values, the processor to modify processor operation based upon comparison of the temperature code with the plurality of programmable temperature trip values. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method comprising:
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selecting a temperature sensor from a plurality of temperature sensors within hotspots of a processor on a semiconductor die, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the respective hotspot; sensing a temperature in the hotspot of the selected temperature sensor; generating a temperature reading in accordance with the sensed temperature, the temperature reading being a digital number composed of a plurality of bits representing the sensed temperature; and controlling internal operations of the processor to regulate temperature based upon the temperature reading, each of said selecting, said sensing, said generating, and said controlling being performed by structures internal to the semiconductor die. - View Dependent Claims (17, 18, 19, 20, 23, 24, 26, 27)
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21. A method comprising:
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selecting a temperature sensor from a plurality of temperature sensors within hotspots of a processor on a semiconductor die, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the respective hotspot; sensing a temperature in the hotspot of the selected temperature sensor; generating a temperature reading in accordance with the sensed temperature; and controlling internal operations of the processor to regulate temperature based upon the temperature reading, each of said selecting, said sensing, said generating, and said controlling being performed by structures internal to the semiconductor die, wherein controlling the internal operation of the processor comprises generating interrupts according to a magnitude of the temperature reading relative to a plurality of threshold values, and further comprising the processor executing instructions that modify the plurality of threshold values.
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22. The method of 16, further comprising:
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selecting another temperature sensor from the plurality of temperature sensors; and repeating said sensing, said generating, and said controlling, for said another temperature sensor.
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25. The method of 16, further comprising storing the temperature reading, or a value based on the temperature reading, in a register readable by software executed on the processor.
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28. A method comprising:
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selecting a temperature sensor from a plurality of temperature sensors within hotspots of a processor on a semiconductor die, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the respective hotspot; sensing a temperature in the hotspot of the selected temperature sensor; generating a temperature reading in accordance with the sensed temperature; and controlling internal operations of the processor to regulate temperature based upon the temperature reading, each of said selecting, said sensing, said generating, and said controlling being performed by structures internal to the semiconductor die, further comprising storing the temperature reading, or a value based on the temperature reading, in a register readable by software executed on the processor.
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29. A system comprising:
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a processor having a plurality of hotspots during operation, each hotspot being a localized region having a higher temperature than regions of the processor adjoining the respective hotspot; a plurality of means for sensing temperature, each within a hotspot of the plurality of hotspots; means for selecting one of the plurality of means for sensing temperature; means for converting a binary number into an analog signal; means for comparing the analog signal with output from the means for selecting one of the plurality of means for sensing temperature; means for storing the binary number as a temperature code, based upon output from the means for comparing the analog signal with output from the means for selecting; means for comparing the temperature code with a plurality of programmable temperature trip values, the processor to modify processor operation based upon output from the means for comparing the temperature code with the plurality of programmable temperature trip values; a die having said processor, said plurality of means for sensing temperature, said means for selecting one of the plurality of means for sensing temperature, means for converting a binary number into an analog signal, said means for comparing the analog signal with output from the means for selecting one of the plurality of means for sensing temperature, said means for storing the binary number as a temperature code, and said means for comparing the temperature code with a plurality of programmable temperature trip values; and means for thermal management, external to the die and responsive to output from the means for comparing the temperature code with the plurality of programmable temperature trip values. - View Dependent Claims (30, 31, 32)
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Specification