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Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures

  • US 7,149,666 B2
  • Filed: 05/30/2002
  • Issued: 12/12/2006
  • Est. Priority Date: 05/30/2001
  • Status: Active Grant
First Claim
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1. A method for determining at least one of a signal reflection, a signal transmission, and a signal coupling among vias in a multi-via electronic package, wherein said electronic package comprises a plurality of vias and at least two parallel layers, comprising the steps of:

  • (a) creating a model of the electronic package as an interior problem and an exterior problem, relative to the at least two parallel layers;

    (b) determining parameters relating to the vias and the parallel planes corresponding to the at least two parallel layers for use in solving said interior problem and said exterior problem;

    (c) solving the interior problem to determine a first property of the model based on the parameters that were determined, such that the interior problem is solved by;

    (i) determining exciting waves using dyalic Green'"'"'s function; and

    (ii) determining an admittance matrix using Foldy-Lax equation;

    (d) using the first property and the parameters to solve the exterior problem, to determine a second property of the model;

    (e) using the second property to determine at least one result selected from the group consisting of;

    the signal reflection, the signal transmission, and the signal coupling among vias in the electronic structure; and

    (f) having determined the at least one result, executing at least one step selected from the group consisting of the following steps;

    (i) storing the result for later use; and

    (ii) outputting the result to a user.

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