Integrated and multi-axis sensor assembly and packaging
First Claim
1. An integrated sensor apparatus comprising:
- a sensor module including;
(a) a housing including a cavity, one or more parallel planar surfaces, a bottom surface of the cavity, a bottom exterior surface, a top exterior surface, one or more side surfaces, one or more bond pads on one or more of the parallel planar surfaces, one or more bond pads on the bottom exterior surface, one or more bond pads on the top exterior surface, and one or more bond pads on one or more of the side surfaces;
(b) a plurality of sensor packages coupled to a substrate in the housing having slots for receiving the sensor packages, each sensor package having an axis of sensitivity positioned in a different spatial direction;
wherein each sensor package has a sensor in the cavity, the sensor resiliently coupled to the housing with at least one coupling and at least one bumper slidingly supporting the sensor; and
(c) a controller coupled to the housing for controlling the sensor module.
5 Assignments
0 Petitions
Accused Products
Abstract
A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).
29 Citations
32 Claims
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1. An integrated sensor apparatus comprising:
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a sensor module including; (a) a housing including a cavity, one or more parallel planar surfaces, a bottom surface of the cavity, a bottom exterior surface, a top exterior surface, one or more side surfaces, one or more bond pads on one or more of the parallel planar surfaces, one or more bond pads on the bottom exterior surface, one or more bond pads on the top exterior surface, and one or more bond pads on one or more of the side surfaces; (b) a plurality of sensor packages coupled to a substrate in the housing having slots for receiving the sensor packages, each sensor package having an axis of sensitivity positioned in a different spatial direction;
wherein each sensor package has a sensor in the cavity, the sensor resiliently coupled to the housing with at least one coupling and at least one bumper slidingly supporting the sensor; and(c) a controller coupled to the housing for controlling the sensor module. - View Dependent Claims (2, 3, 4, 5, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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6. An integrated sensor apparatus comprising:
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(a) a housing including a cavity, one or more parallel planar surfaces, a bottom surface of the cavity, a bottom exterior surface, a top exterior surface, one or more side surfaces, one or more bond pads on one or more of the parallel planar surfaces, one or more bond pads on the bottom exterior surface, one or more bond pads on the top exterior surface, and one or more bond pads on one or more of the side surfaces; and (b) a sensor positioned in the housing cavity;
wherein the housing cavity further includes one or more resilient couplings for resiliently coupling the sensor to the housing, wherein the one or more resilient couplings further include one or more bumpers for slidingly supporting the sensor. - View Dependent Claims (7, 8, 9, 10, 11)
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12. An integrated sensor apparatus comprising:
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a sensor module housing including a cavity for receiving a sensor, one or more parallel planar surfaces, a bottom surface of the cavity, a bottom exterior surface, a top exterior surface, one or more side surfaces, one or more bond pads on one or more of the parallel planar surfaces, one or more bond pads on the bottom exterior surface, one or more bond pads on the top exterior surface, and one or more bond pads on one or more of the side surfaces; a plurality of sensor packages coupled to a substrate in the housing, each sensor package having an axis of sensitivity positioned in a different spatial direction; and a sensor in the cavity of the housing, the cavity further including a bottom surface, wherein one or more bumpers are coupled to the bottom surface of the cavity for slidlingly supporting the sensor in the housing. - View Dependent Claims (13)
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24. A method of packaging a sensor assembly comprising:
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providing a housing; disposing a sensor module within the housing wherein the sensor module includes a plurality of sensor packages coupled to a substrate having slots for receiving the sensor packages, each sensor package having an axis of sensitivity in a different special direction;
wherein each sensor package has a sensor in the cavity, the sensor resiliently coupled to the housing with at least one coupling and at least one bumper slidingly supporting the sensor;disposing a controller on the housing; and coupling the controller to the sensor module with an electrical coupling, wherein the controller is subsequently used to control the sensor module, wherein disposing the controller further comprises; dispensing an adhesive on the housing; placing the controller onto the adhesive; curing the adhesive; wire-bonding the controller to the housing; encapsulating the controller and the wire bonds with an encapsulant; and curing the encapsulant. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
coupling the mounting member to the spring assembly.
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30. The method of claim 29, wherein the mounting member is a shorting clip.
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31. The method of claim 24, wherein the different spatial directions are orthogonal to each other.
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32. The method of claim 24, wherein the sensor packages are coupled to each other.
Specification