Smart label web and a method for its manufacture

• US 7,152,803 B2
• Filed: 06/16/2004
• Issued: 12/26/2006
• Est. Priority Date: 12/21/2001
• Status: Active Grant

• Current Assignee: SMARTRAC Investment B.V. (Avery Dennison Corporation)
• Original Assignee: Upm Rafsec Oy (UPM-Kymmene Oyj)
• Inventors: Strömberg, Samuli
• Primary Examiner(s): Kim, Ahshik
• Application Number:
  US10/869,586
• Publication Number:
  US 20050087607A1
• Time in Patent Office: 923 Days
• Field of Search: 235/375, 235/383, 235/384, 235/385, 235/492, 235/487, 235/488, 340/5.23, 340/5.24, 365/192
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar

Abstract

The present invention relates to manufacture of a smart label web, the smart label web comprising smart labels one after another and/or side by side. The smart label web comprises also a circuitry pattern and an integrated circuit on a chip attached to it. In the method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web in such a way that a structural part separated from a separate carrier web and containing the integrated circuit on the chip is electrically connected to the smart label by pressing mechanically. The structural part or the smart label comprises a thermoplastic film whereby the structural part is attached to the smart label substantially entirely.

Claims

1. A method for the manufacture of a smart label web, comprising:

providing a structural part comprising a base layer and a thermoplastic film attached to each other, the structural part having two ends and comprising an integrated circuit on a chip between the ends, the ends of the structural part and the integrated circuit being in electrical contact with each other;

providing a smart label web base having a circuitry pattern thereon;

forming an electric contact between the integrated circuit on the chip and the circuitry pattern by connecting electrically the ends of the structural part to the contact points of the circuitry pattern in such a manner that at least one end is connected by pressing mechanically; and

attaching the structural part to the smart label web base substantially entirely by the thermoplastic film.

2. The method according to claim 1 wherein the thermoplastic film is on the surface of the base layer.

3. The method according to claim 2 wherein the thermoplastic film on the surface of the base layer comprises a plurality of layers of thermoplastic film.

4. The method according to claim 3 wherein a first layer of thermoplastic film is on the base layer and a second layer of thermoplastic film is on the first layer of thermoplastic film and the second layer melts at a temperature lower than does the first layer.

5. The method according to claim 4 wherein the electrical connection between the structural part and the circuitry pattern on the smart label web comprises a capacitive connection and the thermoplastic film is between conductors which form capacitor plates.

6. The method according to claim 1 wherein the structural part is small with respect to the smart label web base.

7. The method according to claim 1 wherein the electrical connection between the structural part and the circuitry pattern on the smart label web comprises a capacitive connection.

8. The smart label web according to claim 1 wherein the electrical connection between the structural part and the circuitry pattern on the smart label web comprises a capacitive connection.

9. A method for the manufacture of a smart label web, comprising:

providing a structural part comprising a base layer, the structural part having two ends and comprising an integrated circuit on a chip between the ends, the ends of the structural part and the integrated circuit being in electrical contact with each other,

providing a smart label web base having a circuitry pattern thereon;

covering the smart label web base at least partially by a thermoplastic film;

forming an electric contact between the integrated circuit on the chip and the circuitry pattern by connecting electrically the ends of the structural part to the contact points of the circuitry pattern in such a manner that at least one end is connected by pressing mechanically; and

attaching the structural part to the smart label web base substantially entirely by the thermoplastic film.

10. The method according to claim 9 wherein the thermoplastic film comprises a plurality of layers of thermoplastic film.

11. The method according to claim 10 wherein a first layer of thermoplastic film interfaces with the structural part and a second layer of thermoplastic film is between the first layer of thermoplastic film and smart label web base, and the second layer melts at a temperature lower than does the first layer.

12. The method according to claim 11 wherein the structural part is small relative to the smart label web base.

13. The method according to claim 12 wherein the electrical connection between the structural part and the circuitry pattern on the smart label web comprises a capacitive connection.

14. The method according to claim 11 wherein the electrical connection between the structural part and the circuitry pattern on the smart label web comprises a capacitive connection and the thermoplastic film is between conductors which form capacitor plates.

15. A smart label web comprising a plurality of smart labels, the smart label web comprising a smart label web base comprising smart label blanks and a plurality of structural parts, each smart label comprising a circuitry pattern and a structural part comprising a base layer having two ends and comprising an integrated circuit on a chip between the ends, the ends of the structural part and the integrated circuit on the chip being in electrical contact with each other, the integrated circuit on the chip being electrically connected to the circuitry pattern through the ends of the structural part in such a manner that at least one end is connected by a joint made by mechanical pressing, the structural part being attached to the smart label blank substantially entirely by a thermoplastic film.

16. The smart label web according to claim 15 wherein the thermoplastic film is between the base layer of the structural part and the smart label blank, and the thermoplastic film comprises a plurality of layers.

17. The smart label web according to claim 16 wherein a first layer of thermoplastic film interfaces with the base layer of the structural part and a second layer of thermoplastic film is between the first layer of thermoplastic film and the smart label blank, and the second layer melts at a temperature lower than does the first layer of thermoplastic film.

18. The smart label web according to claim 17 wherein the structural part is small relative to the smart label blank.

19. The smart label web according to claim 17 wherein the electrical connection between the structural part and the circuitry pattern on the smart label web comprises a capacitive connection and the thermoplastic film is between conductors which form capacitor plates.