Method of cleaning semiconductor wafer
First Claim
1. A method of cleaning a semiconductor wafer, comprising:
- mounting a wafer to a chuck;
spraying de-ionized water onto the wafer while rotating the chuck, to thereby form a layer of substantially only water on a surface of the wafer;
positioning a gas guard, defining therein a chamber having an open bottom, immediately above the layer of water; and
spraying a cleaning gas through the chamber and into the layer of substantially only water to thereby cause the cleaning gas to dissolve in the layer of water, and at the same time moving the chamber across the surface of the wafer, to thereby clean the wafer.
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Abstract
The present application discloses a method of cleaning a semiconductor wafer by mounting a wafer to a chuck, positioning a gas guard, defining therein a chamber having an open bottom, immediately above the layer of water, spraying de-ionized water onto the wafer while rotating the chuck at a location outside the chamber when the wafer is mounted to the chuck, to thereby form a layer of water on the wafer, and spraying a cleaning gas from a gas spraying unit disposed above said chuck through the chamber and into the layer of water to thereby cause the cleaning gas to dissolve in the layer of water, and at the same time moving the chamber across a surface of the wafer, to thereby clean the wafer, wherein said gas spraying unit includes a gas injection tube oriented to inject the cleaning gas towards the wafer mounted to the chuck, and the gas guard connected to the gas injection tube.
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Citations
16 Claims
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1. A method of cleaning a semiconductor wafer, comprising:
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mounting a wafer to a chuck; spraying de-ionized water onto the wafer while rotating the chuck, to thereby form a layer of substantially only water on a surface of the wafer; positioning a gas guard, defining therein a chamber having an open bottom, immediately above the layer of water; and spraying a cleaning gas through the chamber and into the layer of substantially only water to thereby cause the cleaning gas to dissolve in the layer of water, and at the same time moving the chamber across the surface of the wafer, to thereby clean the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of cleaning a semiconductor wafer, comprising:
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mounting a wafer to a chuck; spraying de-ionized water onto the wafer while rotating the chuck, to thereby form a layer of water on a sufface of the wafer; subsequently moving a gas guard, defining therein a chamber having an open bottom, to a position immediately above the layer of water; and spraying a cleaning gas through the chamber and into the layer of water to thereby cause the cleaning gas to dissolve in the layer of water, and at the same time moving the chamber across the surface of the wafer, to thereby clean the wafer. - View Dependent Claims (10, 11, 12)
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13. A method of cleaning a semiconductor wafer, comprising:
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mounting a wafer to a chuck; positioning a gas guard, defining therein a chamber having an open bottom, immediately above a surface of the wafer; subsequently spraying deionized water onto the surface of the wafer at a location outside of the chamber defined by the gas guard to thereby form a layer of water on the wafer; and spraying a cleaning gas through the chamber and into the layer of water to thereby cause the cleaning gas to dissolve in the layer of water, and at the same time moving the chamber across the surface of the wafer, to thereby clean the wafer. - View Dependent Claims (14, 15, 16)
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Specification