Method of manufacturing transparent electro-conductive film
First Claim
Patent Images
1. A method of manufacturing a transparent electro-conductive film comprising:
- forming a primary layer on a polymer film by coating a silicon compound or a liquid substance including the silicon compound, or depositing the silicon compound by vapor-deposition, andforming a multi-lamination film comprising at least one metal-compound layer and at least one electro-conductive-metal layer on the primary layer,wherein said process of forming the primary layer is conducted by depositing the silicon compound on the polymer film by a physical vapor deposition process including vacuum spraying process, sputtering process, ion plating process, or by a chemical vapor-deposition process,wherein said sputtering process employs Si, SiC, SiO, SiO2, or Si3N4 as a target material, andwherein said SiC target material has a density of 2.9 g/cm3 or greater.
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Abstract
A touch panel includes a transparent electro-conductive film. The transparent electro-conductive film comprises a primary layer formed on a polymer film, and a transparent electro-conductive thin film or a multi-lamination film composed of at least one metal-compound layer and at least one electro-conductive-metal layer is formed on the primary layer. The primary layer is made of silicon compound. The primary layer is formed by sputtering, using a target having a density of 2.9 g/cm3 or more.
5 Citations
15 Claims
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1. A method of manufacturing a transparent electro-conductive film comprising:
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forming a primary layer on a polymer film by coating a silicon compound or a liquid substance including the silicon compound, or depositing the silicon compound by vapor-deposition, and forming a multi-lamination film comprising at least one metal-compound layer and at least one electro-conductive-metal layer on the primary layer, wherein said process of forming the primary layer is conducted by depositing the silicon compound on the polymer film by a physical vapor deposition process including vacuum spraying process, sputtering process, ion plating process, or by a chemical vapor-deposition process, wherein said sputtering process employs Si, SiC, SiO, SiO2, or Si3N4 as a target material, and wherein said SiC target material has a density of 2.9 g/cm3 or greater. - View Dependent Claims (2, 3, 4, 5, 8)
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6. A method of manufacturing a transparent electro-conductive film comprising:
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forming a primary layer on a polymer film by coating a silicon compound or a liquid substance including the silicon compound, or depositing the silicon compound by vapor-deposition, and forming a multi-lamination film comprising at least one metal-compound layer and at least one electro-conductive-metal layer on the primary layer, wherein said process of forming the primary layer is conducted by depositing the silicon compound on the polymer film by a physical vapor deposition process including vacuum spraying process, sputtering process, ion plating process, or by a chemical vapor-deposition process, wherein said sputtering process employs Si, SiC, SiO, SiO2, or Si3N4 as a target material, and wherein said SiC target is produced by sintering a mixture composed of silicon carbide powder and a non-metal sintering assistant.
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7. A method of manufacturing a transparent electro-conductive film, comprising:
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forming a primary layer on a polymer film by coating said polymer film with an ultraviolet-curing resin containing particles of at least one silicon compound selected from the group consisting of SiCx, SiNx, SiCxOy, SiCxNy, SiOxNy and SiCxOyNz; and forming a transparent electro-conductive thin film on the primary layer, wherein said at least one silicon compound is selected from the group consisting of SiCx, where x is 1×
10−
6 to 10;
SiNx, where x is 1×
10−
6 to 5;
SiCxOy, where x is 1×
10−
6 to 10, and y is 1×
10−
6 to 5;
SiCxNy, where x is 1×
10−
6 to 10, and y is 1×
10−
6 to 5;
SiOxNy, where x is 1×
10−
6 to 5, and y is 1×
10−
6 to 5; and
SiCxOyNz, where x is 1×
10−
6 to 10, y is 1×
10−
6 to 5 and is 1×
10−
6 to 5. - View Dependent Claims (9, 10, 11)
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12. A method of manufacturing a transparent electro-conductive film, comprising:
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forming a primary layer on a polymer film by coating said polymer film with an ultraviolet-curing resin containing particles of at least one silicon compound selected from the group consisting of SiC and Si3N4; and forming a transparent electro-conductive thin film on the primary layer.
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13. A method of manufacturing a transparent electro-conductive film, comprising:
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forming a primary layer on a polymer film by sputtering a silicon compound thereon by employing an SIC target; and forming a transparent electro-conductive thin film on the primary layer; wherein the SiC target is produced by sintering a mixture composed of silicon carbide powder and a non-metal based sintering assistant. - View Dependent Claims (14, 15)
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Specification
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Current AssigneeBridgestone Corporation
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Original AssigneeBridgestone Corporation
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InventorsKusano, Yukihiro, Yoshikawa, Masato, Nishida, Mitsuhiro, Iwabuchi, Yoshinori
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Primary Examiner(s)McNeil, Jennifer C.
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Assistant Examiner(s)Speer, Timothy M.
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Application NumberUS10/788,307Publication NumberTime in Patent Office1,030 DaysField of Search428/697, 428/446, 428/448, 428/701, 428/702, 428/458, 345/173, 346/176, 204/192.1, 427/255.18US Class Current427/255.18CPC Class CodesC09K 2323/00 Functional layers of liquid...C09K 2323/03 Viewing layer characterised...C09K 2323/033 Silicon compound, e.g. glas...C09K 2323/053 Organic silicon compound, e...G06F 3/041 Digitisers, e.g. for touch ...G06F 3/045 using resistive elements, e...H01B 1/08 oxidesH01B 1/22 the conductive material com...Y10T 428/25 Web or sheet containing str...Y10T 428/31663 As siloxane, silicone or si...Y10T 428/31667 Next to addition polymer fr...
