Method of fabricating microelectromechanical system structures
First Claim
1. A method of simultaneously bonding components, comprising the steps of:
- providing at least first, second and third components;
at least one of the first, second and third components being comprised of a glass substrate and at least one of the first, second and third components being comprised of a conductive or semiconductive material;
each of the at least first, second and third components having an upper and lower surface;
determining the order of stacking of the at least first, second and third components to establish interfaces between adjacent at least first, second and third components;
applying a hydrogen-free amorphous film to one of the component surfaces at each interface comprising an adjacent;
glass component; and
conductive or semiconductive component;
applying a sol gel with or without alkaline ions film to one of the component surfaces at each interface comprising an adjacent;
conductive or semiconductive component; and
conductive or semiconductive component; and
simultaneously anodically bonding the at least first, second and third components in the determined order of stacking.
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Accused Products
Abstract
A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.
24 Citations
33 Claims
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1. A method of simultaneously bonding components, comprising the steps of:
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providing at least first, second and third components;
at least one of the first, second and third components being comprised of a glass substrate and at least one of the first, second and third components being comprised of a conductive or semiconductive material;
each of the at least first, second and third components having an upper and lower surface;determining the order of stacking of the at least first, second and third components to establish interfaces between adjacent at least first, second and third components; applying a hydrogen-free amorphous film to one of the component surfaces at each interface comprising an adjacent; glass component; and conductive or semiconductive component; applying a sol gel with or without alkaline ions film to one of the component surfaces at each interface comprising an adjacent; conductive or semiconductive component; and conductive or semiconductive component; and simultaneously anodically bonding the at least first, second and third components in the determined order of stacking. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of simultaneously bonding components, comprising the steps of:
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providing at least first, second and third components;
at least one of the first, second and third components being comprised of a glass substrate and at least one of the first, second and third components being comprised of a conductive or semiconductive material;
each of the at least first, second and third components having an upper and lower surface;determining the order of stacking of the at least first, second and third components to establish interfaces between adjacent at least first, second and third components; applying a hydrogen-free amorphous film to one of the component surfaces at each interface comprising an adjacent; glass component; and conductive or semiconductive component; applying a sol gel with or without alkaline ions film to one of the component surfaces at each interface comprising an adjacent; conductive or semiconductive component; and conductive or semiconductive component; and simultaneously anodically bonding the at least first, second and third components in the determined order of stacking at a temperature of from about 200 to 400°
C. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method of simultaneously bonding components, comprising the steps of:
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providing at least first, second and third components;
at least one of the first, second and third components being comprised of a glass substrate and at least one of the first, second and third components being comprised of a conductive or semiconductive material;
each of the at least first, second and third components having an upper and lower surface;determining the order of stacking of the at least first, second and third components to establish interfaces between adjacent at least first, second and third components; applying a hydrogen-free amorphous film to one of the component surfaces at each interface comprising an adjacent; glass component; and conductive or semiconductive component; applying a sol gel with or without alkaline ions film to one of the component surfaces at each interface comprising an adjacent; conductive or semiconductive component; and conductive or semiconductive component; heating the at least first, second and third components; bringing the at least first, second and third components into contact in the determined order of stacking; and applying a voltage to the at least first, second and third components to simultaneously bond the at least first, second and third components. - View Dependent Claims (32, 33)
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Specification