Method for making a semiconductor device including band-engineered superlattice using intermediate annealing
First Claim
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1. A method for making a semiconductor device comprising:
- forming a superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer selected from the group consisting essentially of oxygen, nitrogen, fluorine, and carbon-oxygen constrained within a crystal lattice of adjacent base semiconductor portions, and opposing base semiconductor portions in adjacent groups of layers being chemically bound together; and
performing at least one anneal prior to completing forming of the superlattice.
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Abstract
A method for making a semiconductor device may include forming a superlattice including a plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The method may also include performing at least one anneal prior to completing forming of the superlattice.
134 Citations
31 Claims
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1. A method for making a semiconductor device comprising:
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forming a superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer selected from the group consisting essentially of oxygen, nitrogen, fluorine, and carbon-oxygen constrained within a crystal lattice of adjacent base semiconductor portions, and opposing base semiconductor portions in adjacent groups of layers being chemically bound together; and performing at least one anneal prior to completing forming of the superlattice. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for making a semiconductor device comprising:
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forming a superlattice comprising a plurality of successively deposited groups of layers, each group of layers comprising a plurality of successively deposited base silicon monolayers defining a base silicon portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base silicon portions, and opposing base silicon portions in adjacent groups of layers being chemically bound together; and performing at least one anneal prior to completing the deposition of all of the plurality of base silicon monolayers in at least one group of layers. - View Dependent Claims (20, 21)
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22. A method for making a semiconductor device comprising:
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forming a superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base silicon monolayers defining a base silicon portion and at least one oxygen monolayer constrained within a crystal lattice of adjacent base silicon portions, and opposing base silicon portions in adjacent groups of layers being chemically bound to ether; and performing at least one anneal at a temperature in a range of about 550 to 750°
C. and for a time period in a range of about one to thirty minutes prior to completing forming of the superlattice. - View Dependent Claims (23, 24, 25)
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26. A method for making a semiconductor device comprising:
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forming a superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions, and opposing base semiconductor monolayers in adjacent groups of layers being chemically bound together; and performing at least one anneal prior to completing forming of the superlattice. - View Dependent Claims (27, 28, 29, 30, 31)
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Specification