Flip chip in leaded molded package and method of manufacture thereof
First Claim
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1. A semiconductor die package comprising:
- a lead frame including a plurality of leads;
a semiconductor die including frontside and a backside, wherein the frontside semiconductor die is coupled to the leadframe using solder; and
a molding compound having a window, the molding compound covering at least a portion of the leadframe and at least a portion of the semiconductor die, wherein the plurality of leads extend out of the molding compound and laterally away from the molding compound, andwherein the backside of the semiconductor die is exposed through the window and forms an exterior surface of semiconductor die package and is substantially flush with an exterior surface of the molding compound, andwherein the frontside of the semiconductor die includes a first electrical terminal and the backside of the semiconductor die includes a second electrical terminal.
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Abstract
A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.
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Citations
12 Claims
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1. A semiconductor die package comprising:
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a lead frame including a plurality of leads; a semiconductor die including frontside and a backside, wherein the frontside semiconductor die is coupled to the leadframe using solder; and a molding compound having a window, the molding compound covering at least a portion of the leadframe and at least a portion of the semiconductor die, wherein the plurality of leads extend out of the molding compound and laterally away from the molding compound, and wherein the backside of the semiconductor die is exposed through the window and forms an exterior surface of semiconductor die package and is substantially flush with an exterior surface of the molding compound, and wherein the frontside of the semiconductor die includes a first electrical terminal and the backside of the semiconductor die includes a second electrical terminal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification