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Multi-level microchannel heat exchangers

  • US 7,156,159 B2
  • Filed: 07/01/2003
  • Issued: 01/02/2007
  • Est. Priority Date: 03/17/2003
  • Status: Expired due to Term
First Claim
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1. A heat exchanger comprising:

  • a. a manifold layer having a first plurality of openings for providing a cooling material to the heat exchanger and a second plurality of openings for removing the cooling material from the heat exchanger;

    b. an interface layer coupled to the manifold layer, the interface layer having a plurality of vertically stacked routes, each route extending from one of the first plurality of openings and terminating at a corresponding one of the second plurality of openings, each route for carrying the cooling material, a cross-section of the plurality of routes substantially contained in a plane non-parallel to a heat-exchanging plane; and

    c. a heat-generating device coupled to a bottom surface of the interface layer.

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