LED package for backlight unit

• US 7,156,538 B2
• Filed: 09/30/2004
• Issued: 01/02/2007
• Est. Priority Date: 07/28/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Seon Goo, Han, Kyung Taeg, Park, Chan Wang
• Primary Examiner(s): Luebke; Renee
• Assistant Examiner(s): ZETTL, MARY E
• Application Number:
  US10/953,787
• Publication Number:
  US 20060023451A1
• Time in Patent Office: 824 Days
• Field of Search: 257/330, 373/36, 362/249
• US Class Current: 362/249.06
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.

Claims

1. A Light Emitting Diode (LED) package for a backlight unit, comprising:

a plurality of LEDs;

a plurality of silicon substrates each of which has first and second electrode terminals formed on a top thereof, wherein each of the LEDs is mounted on the first and second electrode terminals;

a die bonding part on which the plurality of silicon substrates is arranged, and which allows the first electrode of at least one silicon substrate to be electrically connected to an external circuit;

a wire bonding part which is spaced from the die bonding part and which allows the second electrode of at least one silicon substrate to be electrically connected to the external circuit so that the LEDs are operated; and

a body having a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged

wherein the plurality of LED is arranged in series in such a way that the opposite polar electrode terminals of the silicon substrates are connected to each other by wire, one of the first electrodes terminals are connected to the die bonding part, and one of the second electrodes terminals are connected to the wire bonding part.

2. The LED package for a backlight unit as set forth in claim 1, wherein the plurality of LEDs is aligned along a same line.

3. The LED package for a backlight unit as set forth in claim 1, wherein the molding cup and the base are formed as a single body.

4. The LED package for a backlight unit as set forth in claim 1, further comprising at least one support that is formed to traverse a length of the LED package and prevents deformation of the LED package.

5. A Light Emitting Diode(LED) package for a backlight unit, comprising:

a plurality of LEDs;

a plurality of silicon substrates, each of which has a first electrode terminal formed on a top thereof, and second electrode terminals formed on the top and a bottom thereof, respectively, and connected to each other through a via, wherein each of the LEDs is mounted on the first and second electrode terminals;

a die bonding part on which the plurality of silicon substrates is arranged, and which allows the second electrode of at least the one silicon substrate to be electrically connected to an external circuit;

a wire bonding part which is spaced from the die bonding part, and which allows the first electrode of at least the one silicon substrate to be electrically connected to the external circuit so that the LEDs are operated; and

a body having a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding are arranged,

wherein the plurality of LED is arranged in parallel in such a way that one of the first electrode terminals of the silicon substrates is connected to the wire bonding part by wire and the second electrode terminals formed on the bottom of the silicon substrates are attached to the die bonding part by conductive material.