Process for forming a patterned thin film structure for in-mold decoration

• US 7,156,945 B2
• Filed: 09/19/2003
• Issued: 01/02/2007
• Est. Priority Date: 04/24/2002
• Status: Expired due to Fees

• Current Assignee: ETANSI, Inc.
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Liang, Rong-Chang, Chaug, Yi-Shung, Wang, Xiaojia, Zang, Hongmei, Kiluk, Sean, Tseng, Scott
• Primary Examiner(s): Fiorilla; Chris
• Assistant Examiner(s): Chan; Sing P.
• Application Number:
  US10/665,992
• Publication Number:
  US 20040112237A1
• Time in Patent Office: 1,201 Days
• Field of Search: 156/247, 156/277, 156/278, 156/344, 156/584, 427154-156, 427272-274, 427/282, 101/128.21, 101/129, 101/114, 118/504, 438/478, 438/479, 438/759, 438/763
• US Class Current: 156/701
• CPC Class Codes: B29C 45/14811 Multilayered articles B29C45/14827 takes precedence
• CPC Class Codes: B29K 2995/002 Coloured
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/20 on organic substrates
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G09F 7/165 obtained by a treatment of the support
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2203/0257 Brushing, e.g. cleaning the conductive pattern by brushing or wiping
• CPC Class Codes: H05K 2203/0264 Peeling insulating layer, e.g. foil, or separating mask
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0746 Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
• CPC Class Codes: H05K 3/04 the conductive material being removed mechanically, e.g. by punching
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/146 By vapour deposition
• CPC Class Codes: H05K 3/16 by cathodic sputtering
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing
• CPC Class Codes: Y10S 156/922 : Specified electronic component delaminating in preparation for recycling
• CPC Class Codes: Y10T 156/11 : Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1189 : with shearing during delaminating

Abstract

A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.

Claims

1. A process for forming a patterned thin film structure on a substrate, comprising:

printing on the substrate with a first material a pattern defining a positive image of a decorative design to be formed on the substrate such that the first material is printed in the area where the thin film structure is to be formed, the first material being strippable using a first solvent;

overcoating the printed surface of the substrate with a second material that is not strippable using the first solvent;

stripping the first material away using the first solvent in a process that strips away the first material and the second material formed on the first material without stripping away the second material formed directly on the substrate, such that the second material remains coated on the substrate where the first material was not present, thereby defining a negative image of the decorative design to be formed on the substrate such that the second material remains in the area where the thin film structure is not to be formed;

depositing a thin film material on the patterned substrate; and

stripping to remove the second material and the thin film material deposited on the second material to form the thin film structure in the shape of the decorative design;

wherein the substrate and the patterned thin film structure formed thereon are suitable for use as an IMD decorated film.

2. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the first material repels the second material such that the second material fills in the areas of the substrate where the first material has not been printed without coating the areas where the first material is present.

3. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous solution or water.

4. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the first solvent is a non-aqueous solvent or solution.

5. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous basic solution, and the step of stripping the second material comprises using a second solvent comprising an aqueous acidic solution, an aqueous neutral solution, or water.

6. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous acidic solution and the step of stripping the second material comprises using a second solvent comprising an aqueous basic solution, an aqueous neutral solution, or water.

7. The process for forming a patterned thin film structure on a substrate as recited in claim 1, wherein the first solvent is an aqueous neutral solution or water and the step of stripping the second material comprises using a second solvent comprising an aqueous acidic solution or an aqueous basic solution.