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Method to reduce adhesion between a conformable region and a pattern of a mold

  • US 7,157,036 B2
  • Filed: 06/17/2003
  • Issued: 01/02/2007
  • Est. Priority Date: 06/17/2003
  • Status: Expired due to Term
First Claim
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1. A method of reducing adhesion forces between a conformable material on a substrate and a mold having an initial pattern, said method comprising:

  • forming said conformable material on said substrate by depositing, upon said substrate, a conformable composition having a polymerizable compound and non-ionic sufactant molecules, with said non-ionic surfactant molecules being concentrated in a first region of said conformable material with said polymerizable compound being concentrated in a second region of said conformable composition;

    contacting said conformable material with said mold; and

    solidifying said polymerizable compound, defining solidified material with said first region being positioned between said second region and said mold and a subset of said non-ionic surfactant molecules having an affinity for said mold that is greater than an affinity for said solidified material.

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