Structured integrated circuit device
First Claim
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1. A semiconductor device comprising:
- a logic array, said logic array including a multiplicity of logic cells,said logic array further including metal and via connection layers overlying the multiplicity of logic cells for providing at least one permanent customized interconnect between various inputs and outputs thereof, wherein said customized interconnect is customized by a custom via layer; and
a multiplicity of device customized I/O cells, wherein said customized I/O cells are customized by said custom via layer, and wherein said I/O cells comprise at least three rows of pads.
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Abstract
A configurable logic array may include: a multiplicity of logic cells, containing look-up tables; customizable metal and via connection layers overlying the multiplicity of logic cells; a multiplicity of device customizable I/O cells; a multiplicity of configuration customizable RAM blocks; a ROM block with customizable contents; and a microprocessor with customizable I/O for configuring and testing the array, where the customizations are all done on a single via layer.
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Citations
3 Claims
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1. A semiconductor device comprising:
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a logic array, said logic array including a multiplicity of logic cells, said logic array further including metal and via connection layers overlying the multiplicity of logic cells for providing at least one permanent customized interconnect between various inputs and outputs thereof, wherein said customized interconnect is customized by a custom via layer; and a multiplicity of device customized I/O cells, wherein said customized I/O cells are customized by said custom via layer, and wherein said I/O cells comprise at least three rows of pads. - View Dependent Claims (2)
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3. A semiconductor device comprising:
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a logic array, said logic array including a multiplicity of logic cells, said logic array further including metal and via connection layers overlying the multiplicity of logic cells for providing at least one permanent customized interconnect between various inputs and outputs thereof, wherein said customized interconnect is customized by a custom via layer; and a customizable clock distribution structure, wherein said customizable clock distribution structure comprises at least one of the components selected from the group consisting of; a customizable trimmer cell to fine tune said clock distribution structure'"'"'s delay, wherein said customizable trimmer cell is customized by said custom via layer; and customizable connections to a phase lock loop circuit, wherein said customizable connections determine the phase and frequency of each clock.
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Specification