Process monitoring device for sample processing apparatus and control method of sample processing apparatus

• US 7,158,848 B2
• Filed: 02/17/2006
• Issued: 01/02/2007
• Est. Priority Date: 03/05/2001
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Tanaka, Junichi, Ikuhara, Shoji, Yamamoto, Hideyuki, Takahashi, Kazue, Kitsunai, Hiroyuki
• Primary Examiner(s): Picard; Leo
• Assistant Examiner(s): KOSOWSKI, ALEXANDER J
• Application Number:
  US11/356,099
• Publication Number:
  US 20060142888A1
• Time in Patent Office: 319 Days
• Field of Search: 700/108, 700/110, 700/121, 438/9, 438/14, 438 16- 17
• US Class Current: 700/108
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 21/02 electric
• CPC Class Codes: G05B 2219/32053 Adjust work parameter as function of other cell
• CPC Class Codes: G05B 2219/32182 If state of tool, product deviates from standard, adjust system, feedback
• CPC Class Codes: G05B 23/0221 Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A plasma processing apparatus for processing a sample within a vacuum vessel, including: a plurality of sensors for detecting plural kinds of information relating to a processing state of the sample as monitor data; data selecting means for selecting a detection time range of the monitor data thus detected which is used for monitoring the plasma processing apparatus; a signal filter for converting the monitor data within the selected detection time range into an effective signal; a model expression unit for generating a predicted value of a patterned physical-shape of a sample based on the effective signal; and a display screen for displaying the patterned physical-shape predicted value; wherein the display screen displays the patterned physical-shape predicted value without measuring a patterned shape after processing of the sample.

Claims

1. A plasma processing apparatus for processing a sample by using plasma on a lot unit basis, comprising:

a plurality of sensors which detect plural kinds of information relating to a processing state of the sample, as monitor data;

data selecting means for selecting a detection time range of the monitor data thus detected, which is used for monitoring the plasma processing apparatus;

a signal filter which converts the monitor data within the selected detection time range into a converted signal;

a processing performance prediction section which predicts a pattern shape of the sample based on the converted signal;

a parameter modification quantity calculation section which calculates a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value;

a storing unit which stores the correction quantity of the processing parameter, and

a correction quantity conversion table used to convert the correction quantity of a processing parameter obtained by the parameter modification quantity calculation section when a kind of a next sample of a next lot is different from the sample, thereby to use a converted correction quantity of the processing parameter for a processing of the next sample.

2. A plasma processing apparatus for processing a sample by using plasma on a lot unit basis, comprising:

a plurality of sensors which detect plural kinds of information relating to a processing state of the sample, as monitor data;

data selecting means for selecting a detection time range of the monitor data thus detected, which is used for monitoring the plasma processing apparatus;

a signal filter which converts the monitor data within the selected detection time range, into a converted signal;

a processing performance prediction section which predicts a pattern shape of the sample based on the converted signal;

a parameter modification quantity calculation section which calculates a correction quantity of a processing parameter, for decreasing a deviation between the predicted pattern shape and a standard value; and

a storing unit which stores the correction quantity of the processing parameter,

wherein a correction quantity of a processing parameter obtained by the parameter modification quantity calculation section at a time of processing a sample at a position of one lot is used for a processing of a sample at the same position of a next lot.