Micromachined gyroscopic sensor with detection in the plane of the machined wafer
First Claim
1. A gyroscope with a vibrating structure, produced by micromachining a thin flat wafer, comprising:
- two symmetrical moving assemblies coupled by a coupling structure that connects the two assemblies in order to allow mechanical vibration energy to be transferred between the two moving assemblies, wherein each of the two symmetrical moving assemblies comprises two moving elements, an inertial first moving element being connected to the coupling structure and able to vibrate in two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer, and a second moving element being connected, on one side, to the first element and, on the other side, to fixed anchoring regions via linking means that allow the vibration movement of the first element in the Oy direction to be transmitted to the second element without permitting any movement of the second element in the Ox direction, an excitation structure being associated with the first moving element in order to excite a vibration of the first element along Ox, and a movement detection structure being associated with the second moving element in order to detect a vibration of the second element along Oy, the first moving element being a rectangular intermediate frame surrounding the second moving element, denoted by a moving mass, and the coupling structure comprising two outer frames, each of which surrounds the intermediate frame of a respective moving assembly.
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Abstract
The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.
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Citations
11 Claims
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1. A gyroscope with a vibrating structure, produced by micromachining a thin flat wafer, comprising:
two symmetrical moving assemblies coupled by a coupling structure that connects the two assemblies in order to allow mechanical vibration energy to be transferred between the two moving assemblies, wherein each of the two symmetrical moving assemblies comprises two moving elements, an inertial first moving element being connected to the coupling structure and able to vibrate in two degrees of freedom in orthogonal directions Ox and Oy of the plane of the wafer, and a second moving element being connected, on one side, to the first element and, on the other side, to fixed anchoring regions via linking means that allow the vibration movement of the first element in the Oy direction to be transmitted to the second element without permitting any movement of the second element in the Ox direction, an excitation structure being associated with the first moving element in order to excite a vibration of the first element along Ox, and a movement detection structure being associated with the second moving element in order to detect a vibration of the second element along Oy, the first moving element being a rectangular intermediate frame surrounding the second moving element, denoted by a moving mass, and the coupling structure comprising two outer frames, each of which surrounds the intermediate frame of a respective moving assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
Specification