Electrically opened micro fluid valve

• US 7,159,618 B2
• Filed: 06/15/2004
• Issued: 01/09/2007
• Est. Priority Date: 06/16/2003
• Status: Expired due to Fees

• Current Assignee: Biomerieux B.V. (Compagnie Merieux Alliance SAS), Snpe Materiaux Energetiques (Government of France)
• Original Assignee: Biomerieux B.V. (Compagnie Merieux Alliance SAS), Snpe Materiaux Energetiques (Government of France)
• Inventors: Roller, Denis, Broyer, Patrick, Colin, Bruno
• Primary Examiner(s): Chambers; A. Michael
• Application Number:
  US10/559,454
• Publication Number:
  US 20060180223A1
• Time in Patent Office: 938 Days
• Field of Search: 137/828, 137/833, 137/807, 251/368, 422/100
• US Class Current: 137/828
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/008 Multi-layer fabrications
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0036 operated by temperature variations
• CPC Class Codes: F16K 99/0067 actuated by a pyrotechnical charge
• CPC Class Codes: Y10T 137/2082 Utilizing particular fluid
• CPC Class Codes: Y10T 137/2196 Acoustical or thermal energy
• CPC Class Codes: Y10T 137/2224 Structure of body of device

Abstract

The invention relates to an electrically-opened micro fluid-valve. The inventive valve comprises: at least one planar support (12); at least one afferent microchannel (14); at least one efferent microchannel (16), said microchannels being arranged in the support (12); such that at least one of the ends (141 and 161) thereof touch the inner face (121) of the support close to one another; at least one deposit (18) of a heat-sensitive material which is disposed on the inner face (121) of the support (12); and at least one heating means (20). According to the invention, the aforementioned deposit (18) of heat-sensitive material at least partially seals the space separating the ends (141 and 161) of the microchannels (14 and 16), thereby preventing same from intercommunicating. When the temperature of the above-mentioned heating means (20) is raised, the structure of the heat-sensitive material is altered, thereby at least partially opening the ends of the microchannels an the space therebetween, in order to enable communication between said microchannels and to restore the flow of the fluid.

Claims

1. An electrically openable microfluidic valve, characterized in that it comprises:

at least one plane support;

at least one afferent microchannel;

at least one efferent microchannel;

said microchannels being provided in the support, so that at least one of their ends and opens onto the internal face of said support, near one another;

at least one deposit of a heat-sensitive material laid out on the internal face of the support; and

at least one heating means;

so that the deposit of heat-sensitive material at least partly closes off the space separating the ends and of the microchannels and, thus preventing the latter from communicating with one another;

the increase in temperature by the heating means resulting in a modification of the structure of the heat-sensitive material, thus at least partially clearing the ends of the microchannels and the space between the latter, so as to allow communication between said microchannels and to restore flow of the fluid.

2. The microfluidic valve as claimed in claim 1, characterized in that it further includes at least one coating layer bonded to the support.

3. The microfluidic valve as claimed in claim 2, characterized in that the coating layer includes a recess lying in the extension of the ends and of the microchannels and.

4. The microfluidic valve as claimed in claim 1, characterized in that the heat-sensitive material is a thermofusible material.

5. The microfluidic valve as claimed in claim 4, characterized in that the thermoplastic material is taken from the group comprising thermofusible polymers and thermofusible or hot-melt adhesives.

6. The microfluidic valve as claimed in claim 1, characterized in that the heat-sensitive material is a heat-expandable material.

7. The microfluidic valve as claimed in claim 6, characterized in that the heat-expandable material is deposited in a well made on the internal face of the support.

8. The microfluidic valve as claimed in claim 1, characterized in that the heat-sensitive material is a heat-shrinkable material.

9. The microfluidic valve as claimed in claim 1, characterized in that the heat-sensitive material is a pyrotechnic composition.

10. The microfluidic valve as claimed in claim 9, characterized in that the pyrotechnic composition is a nitrocellulose-based composition.

11. The microfluidic valve as claimed in claim 1, characterized in that the heating means comprises at least one conducting track, having conducting zones, and at least one preferential heating zone, optionally at least partly in contact with the deposit of heat-sensitive material.

12. The microfluidic valve as claimed in claim 11, characterized in that the increase in temperature of the preferential heating zone is obtained by applying an electric current to the conducting track.

13. The microfluidic valve as claimed in claim 11, characterized in that the preferential heating zone is formed by a deposit of a resistive material.

14. The microfluidic valve as claimed in claim 11, characterized in that the preferential heating zone is a heating zone of restricted cross section of the conducting track.

15. The microfluidic valve as claimed in claim 1, characterized in that it further includes a gas evacuation means.

16. A process for fabricating a microfluidic valve as claimed in claim 1, characterized in that it comprises the following steps:

a) fabrication of the plane support, which includes at least one afferent microchannel and at least one efferent microchannel;

b) deposition of the heat-sensitive material by bonding a film to the internal face of the support so as to close off the ends and of said microchannels and; and

c) deposition of at least one conducting track, which includes at least one preferential heating zone at least partly on said deposit of heat-sensitive material,

it being possible for steps b) and c) to be reversed.

17. The process as claimed in claim 16, characterized in that it further includes a step of depositing a coating layer by bonding a film to the plane support.

18. The process as claimed in claim 16, characterized in that the films constituting the deposit of heat-sensitive material and the coating layer are bonded to the plane support by hot or cold lamination, or by bonding using a hot-melt adhesive.

19. The process as claimed in claim 16, characterized in that the conducting track is deposited:

by photoetching of the conducting zones and screenprinting or pressure-pad printing of the preferential heating zone;

or

by photolithography of the conducting zones and of the preferential heating zone.

20. A microsystem, comprising:

at least one microfluidic valve produced by the process of claim 16.

21. A microsystem, comprising:

at least one microfluidic valve, each microfluidic valve including the microfluidic valve of claim 1.

22. A method of opening a microfluidic valve as claimed in claim 1, characterized in that it comprises the following steps:

application of an electric current in at least one conducting track having a preferential heating zone;

increase in the temperature of the preferential heating zone;

modification of the structure of the heat-sensitive material in contact with the preferential heating zone;

at least partial clearing of the ends of the microchannels and of the space between the latter, so as to establish communication between said microchannels; and

restoration of the fluid flow.