Semiconductor light-emitting device and method of manufacturing the same

• US 7,161,190 B2
• Filed: 08/01/2005
• Issued: 01/09/2007
• Est. Priority Date: 08/02/2004
• Status: Active Grant

• Current Assignee: LedComm LLC (IPValuation Partners, LLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Chikugawa, Hiroshi
• Primary Examiner(s): Tran, Minhloan
• Assistant Examiner(s): Rodela, Eduardo A.
• Application Number:
  US11/193,364
• Publication Number:
  US 20060022216A1
• Time in Patent Office: 526 Days
• Field of Search: 257/79, 257/99
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the first and second lead frames, and a heat-radiating member bonded to a back face of the first lead frame with a brazing member (electrically-conductive layer) containing metal interposed therebetween. The brazing member and the heat-radiating member are formed immediately below and around the light-emitting element.

Claims

1. A semiconductor light-emitting device, comprising:

a light-emitting element;

a first lead frame having a main surface having said light-emitting element mounted thereon;

a resin portion for fixing said first lead frame, said resin portion has a reflecting portion reflecting light emitted from said light-emitting element; and

a heat-radiating member bonded to a back face of said first lead frame with an electrically-conductive layer containing metal interposed therebetween, said electrically-conductive layer is formed to extend from an area below the reflecting portion to the area outside the area covered by the reflecting portion.

2. The semiconductor light-emitting device according to claim 1, wherein said electrically-conductive layer and said heat-radiating member are formed immediately below and around said light-emitting element.

3. The semiconductor light-emitting device according to claim 1, wherein said heat-radiating member has a cavity portion serving as a coolant channel.

4. The semiconductor light-emitting device according to claim 1, wherein said heat-radiating member is provided to couple a plurality of said first lead frames each having light-emitting element mounted thereon.

5. The semiconductor light-emitting device according to claim 1, wherein said heat-radiating member contains at least one material selected from the group consisting of copper, aluminum, a copper alloy, and an aluminum alloy.

6. The semiconductor light-emitting device according to claim 1, wherein said heat-radiating member is formed of a ceramic material.

7. The semiconductor light-emitting device according to claim 6, further comprising a second lead frame spaced apart from said first lead frame and electrically connected to said light-emitting element via a wire, wherein

said heat-radiating member is bonded to the back face of said first lead frame and a back face of said second lead frame with said electrically-conductive layer interposed therebetween, and

said electrically-conductive layer is split in order to make said first lead frame and said second lead frame electrically non-conductive via said electrically-conductive layer in a gap between said first and second lead frames.

8. The semiconductor light-emitting device according to claim 1, wherein

said first lead frame has a plurality of said light-emitting elements mounted thereon, and

said heat-radiating member is provided in a lower portion of each of the plurality of said light-emitting elements.

9. A semiconductor light-emitting device, comprising:

a plurality of light-emitting elements;

a plurality of first lead frames each having a main surface and a respective light-emitting element mounted thereon;

resin portions for fixing each of said first lead frames;

a heat-radiating member bonded to a back face of each of said first lead frames with an electrically-conductive layer containing metal interposed therebetween, wherein said heat-radiating member is provided to couple said plurality of first lead frames;

a cavity within said heat-radiating member serving as a coolant channel; and

a circulating pump for circulating coolant through said coolant channel.

10. A semiconductor light-emitting device, comprising:

a plurality of light-emitting elements;

a first lead frame having a main surface, and an entire surface of each said plurality of light-emitting elements are mounted on said main surface of said first lead frame;

a resin portion for fixing said first lead frame; and

a plurality of heat-radiating members bonded to a back face of said first lead frame with an electrically-conductive layer containing metal interposed therebetween, wherein

said plurality of heat-radiating members are provided in a lower portion of each of the plurality of said light-emitting elements.