Structure and method for fabricating semiconductor structures and devices for detecting an object

• US 7,161,227 B2
• Filed: 06/29/2004
• Issued: 01/09/2007
• Est. Priority Date: 08/14/2001
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Lempkowski, Robert, Chason, Marc
• Primary Examiner(s): Pert; Evan
• Assistant Examiner(s): Mandala, Jr.; Victor A.
• Application Number:
  US10/878,414
• Publication Number:
  US 20040232430A1
• Time in Patent Office: 924 Days
• Field of Search: None
• US Class Current: 257/531
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02488 Insulating materials
• CPC Class Codes: H01L 21/02505 consisting of more than two layers
• CPC Class Codes: H01L 21/02513 Microstructure
• CPC Class Codes: H01L 21/02521 Materials
• CPC Class Codes: H01L 21/8221 Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 21/8258 the substrate being a semiconductor, using a combination of technologies covered by H01L21/8206, H01L21/8213 , H01L21/822, H01L21/8252, H01L21/8254 or H01L21/8256
• CPC Class Codes: H01L 2224/80001 by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
• CPC Class Codes: H01L 27/0605 integrated circuits made of compound material, e.g. AIIIBV
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 29/812 with a Schottky gate H01L29/7725, H01L29/775, H01L29/778, H01L29/806 take precedence; with Schottky contact on top of heterojunction gate H01L29/802
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01S 2301/173 The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
• CPC Class Codes: H01S 5/021 Silicon based substrates
• CPC Class Codes: H01S 5/0218 Substrates comprising semiconducting materials from other groups of the Periodic Table than the materials of the active layer
• CPC Class Codes: H01S 5/0261 Non-optical elements, e.g. laser driver components, heaters H01S5/0265 takes precedence
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. A high quality layer of compound semiconductor material is used to form a source component and a receiver component that are interconnected with an antenna and each other within a semiconductor structure that can detect a parameter, such as the speed, of an object.

Claims

1. A semiconductor structure comprising:

a monocrystalline compound semiconductor material;

a source component overlying the monocrystalline compound semiconductor material, the source component being operable to generate electromagnetic energy;

first interconnect coupled between the antenna and the source component, the first interconnect being operable to guide a first portion of the electromagnetic energy from the source component to an antenna that transmits the first portion of the electromagnetic energy;

a receiver component overlying the monocrystalline compound semiconductor material; and

a second interconnect coupled between the antenna and the receiver component,

wherein the first interconnect is further coupled between the source component and the receiver component and operable to guide a second portion of the electromagnetic energy from the source component to the receiver component, the second portion being operable as a reference signal, and wherein the receiver component is operable to generate a detection signal in response to a reflection of the first portion of the electromagnetic energy received at the antenna from an object that is external to the semiconductor structure, the first portion of electromagnetic energy being coupled to the receive component by the second interconnect.

2. The semiconductor structure of claim 1, wherein the source component is one of a radio frequency (RE) transmitter and an optical source component.

3. The semiconductor structure of claim 2, wherein the source component is one of a vertical cavity surface emitting laser (VCSEL), a group III–

V compound semiconductor laser, and a light emitting diode (LED).

4. The semiconductor structure of claim 3, wherein the group III–

V compound semiconductor laser is one of a gallium arsenide (GaAs) laser, an aluminum gallium arsenide (AIGaAs) laser, a gallium nitride (GaN) laser, an indium phosphide (InP) laser, and an indium gallium arsenide (InGasAs) laser.

5. The semiconductor structure of claim 1, wherein the receiver component is one of a radio frequency (RF) receiver and an optical detector component.

6. The semiconductor structure of claim 5, wherein the optical detector component is one of a photodetector and a photoelectric detector.

7. The semiconductor structure of claim 6, wherein the photodetector is one of a photodiode and a phototransistor.

8. The semiconductor structure of claim 7, wherein the photoelectric detector is a group III–

V compound semiconductor detector.

9. The semiconductor structure of claim 8, wherein the group III–

V compound semiconductor detector is one of a gallium arsenide (GaAs) detector, an aluminum gallium arsenide (AIGaAs) detector, a gallium nitride (GaN) detector, an indium phosphide (InP) detector, and an indium gallium arsenide (InGaAs) detector.

10. The semiconductor structure of claim 1, wherein the first and second interconnects are one of optical waveguides and a metallic waveguides.

11. The semiconductor structure of claim 10, wherein the optical waveguides are formed from one of an organic material, an inorganic material, and a gas medium.

12. The semiconductor structure of claim 11, wherein the organic material is one of an epoxy, a polycarbonate, a polystyrene, a polymethyl methacrylate, a polysulfone, a polyimide, and a polyurethane material.

13. The semiconductor structure of claim 11, wherein the organic material is one of a glass and a ceramic material.

14. The semiconductor structure of claim 13, wherein the ceramic material is one of a silica, a lithium niobate, a lead lanthamum, a zirconate titanate and a barium titanate (BTO) material.

15. The semiconductor structure of claim 1, wherein the first and second interconnects each comprise a reflective component, the reflective component being operable to guide the electromagnetic energy.

16. The semiconductor structure of claim 1, wherein the antenna is a horn antenna.

17. The semiconductor structure of claim 1 further comprising a processor overlying the monocrystalline compound semiconductor material and coupled to the receiving component, wherein the processor is operable to determine a parameter associated with the object based on the reference signal received by the receiving component and the detection signal generated by the receiving component, wherein the parameter is one of a direction, a distance, a height, and a speed.

18. The semiconductor structure of claim 1, wherein the electromagnetic energy in one of the radio, microwave, infrared, visible light and ultraviolet spectrums.