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System and method for providing thermal compensation for an interferometric modulator display

  • US 7,161,730 B2
  • Filed: 07/22/2005
  • Issued: 01/09/2007
  • Est. Priority Date: 09/27/2004
  • Status: Expired due to Fees
First Claim
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1. A system for thermal compensation of a microelectromechanical system (MEMS) device, the system comprising:

  • a substrate characterized by a first thermal expansion coefficient;

    at least two members coupled to the substrate, the members being spaced apart by a space;

    a movable layer characterized by a second thermal expansion coefficient and coupled to the at least two members; and

    a film located proximate to the substrate and having a third thermal expansion coefficient, the film extending below and across the space between the two members,wherein the film is configured to compensate for expansion of the movable layer with respect to the substrate when the MEMS device is exposed to thermal energy.

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