Heat spreader module

• US 7,161,807 B2
• Filed: 02/20/2004
• Issued: 01/09/2007
• Est. Priority Date: 02/21/2003
• Status: Active Grant

• Current Assignee: NGK Insulators Limited
• Original Assignee: NGK Insulators Limited
• Inventors: Miyahara, Makoto, Ishikawa, Takahiro, Ishikawa, Shuhei, Nakayama, Nobuaki, Shinkai, Masayuki, Inoue, Kazuyoshi
• Primary Examiner(s): Thompson; Gregory D
• Application Number:
  US10/783,892
• Publication Number:
  US 20040207987A1
• Time in Patent Office: 1,054 Days
• Field of Search: 361/708
• US Class Current: 361/708
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600° and 900° C. for 10 minutes.

Claims

1. A heat spreader module, comprising:

a base;

a heat spreader member joined on said base, said heat spreader member comprising a composite material including carbon and one of copper and a copper alloy; and

an insulating substrate arranged on said heat spreader member,

wherein said base, said heat spreader member, and said insulating substrate are joined with a hard solder material having a melting point of not less than 600°

C.,

wherein said base includes a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK when subjected to a heat treatment between 600° and

900°

C. for 10 minutes, and

wherein the copper alloy of said base is any one of;

(a) a copper alloy comprising 0.1 to 1.5 mass % Cr and the balance being Cu;

(b) a copper alloy comprising 0.1 to 0.5 mass % Zr and the balance being Cu;

(c) a copper alloy comprising 0.05 to 0.3 mass % Zr, 0.3 to 1.2 mass % Cr, and the balance being Cu;

(d) a copper alloy comprising 0.01 to 1.5 mass % Ag and the balance being Cu;

(e) a copper alloy comprising 1.4 to 3.0 mass % Fe, 0.05 to 0.2 mass % Zn, 0.01 to 0.1 mass % P, and the balance being Cu; and

(f) alumina-dispersed copper.

2. The heat spreader module according to claim 1, wherein said composite material comprises a C base material impregnated with copper or a copper alloy.

3. The heat spreader module according to claim 1, wherein said insulating substrate includes one of AlN and Si₃N₄.

4. The heat spreader module according to claim 1, wherein said base has a thickness of not less than 0.5 mm, and said thickness is not more than 40% of an entire thickness of said heat spreader module.

5. The heat spreader module according to claim 1, wherein an IC chip is arranged on said insulating substrate with an electrode interposed between said IC chip and said insulating substrate.

6. The heat spreader module according to claim 1, wherein a heat-releasing member is joined under said heat spreader member.

7. A heat spreader module, comprising:

a base;

a heat spreader member joined on said base, said heat spreader member comprising a composite material including SiC and one of copper and a copper alloy; and

an insulating substrate arranged on said heat spreader member,

wherein said base, said heat spreader member, and said insulating substrate are joined with a hard solder material having a melting point of not less than 600°

C.,

wherein said base includes a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK when subjected to a heat treatment between 600° and

900°

C. for 10 minutes, and

wherein the copper alloy of said base is any one of;

(a) a copper alloy comprising 0.1 to 1.5 mass % Cr and the balance being Cu;

(b) a copper alloy comprising 0.1 to 0.5 mass % Zr and the balance being Cu;

(c) a copper alloy comprising 0.05 to 0.3 mass % Zr, 0.3 to 1.2 mass % Cr, and the balance being Cu;

(d) a copper alloy comprising 0.01 to 1.5 mass % Ag and the balance being Cu;

(e) a copper alloy comprising 1.4 to 3.0 mass % Fe, 0.05 to 0.2 mass % Zn, 0.01 to 0.1 mass % P, and the balance being Cu; and

(f) alumina-dispersed copper.

8. The heat spreader module according to claim 7, wherein said composite material comprises an SiC base material impregnated with copper or a copper alloy.

9. The heat spreader module according to claim 7, wherein said insulating substrate includes one of AlN and Si₃N₄.

10. The heat spreader module according to claim 7, wherein said base has a thickness of not less than 0.5 mm, and said thickness is not more than 40% of an entire thickness of said heat spreader module.

11. The heat spreader module according to claim 7, wherein an IC chip is arranged on said insulating substrate with an electrode interposed between said IC chip and said insulating substrate.

12. The heat spreader module according to claim 7, wherein a heat-releasing member is joined under said heat spreader member.