Integral heat spreader

• US 7,161,809 B2
• Filed: 09/15/2004
• Issued: 01/09/2007
• Est. Priority Date: 09/15/2004
• Status: Active Grant

• Current Assignee: NeoGraf Solutions, LLC
• Original Assignee: Advanced Energy Technology Inc. (Graftech International Limited)
• Inventors: Reynolds, Robert Anderson III, Norley, Julian, Shives, Gary D., Ford, Brian M.
• Primary Examiner(s): Chérvinsky; Boris
• Application Number:
  US10/941,639
• Publication Number:
  US 20060056157A1
• Time in Patent Office: 846 Days
• Field of Search: 361/704, 361/707, 361/719, 257/706, 165/80.3, 165/185, 174/16.1, 428/408
• US Class Current: 361/719
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/373 Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 7/20472 Sheet interfaces

Abstract

A thermal solution for equipment containing a heat-generating component, which is positioned between the heat-generating component and an external surface of the equipment, where the thermal solution facilitates heat dissipation from the heat-generating component while shielding the external surface from the heat generated by the heat-generating component.

Claims

1. A thermal solution for equipment containing a heat-generating component, comprising:

a housing for equipment comprising a first component which comprises a heat source, wherein the first component transmits heat to a surface of the housing in communication therewith, the housing comprising at least one sheet of compressed particles of exfoliated graphite with a density of at least 1.1 g/cm³ sandwiched between two housing layers.

2. The solution of claim 1, wherein the at least one sheet of graphite has an in-plane thermal conductivity of at least about 140 W/m°

K.

3. The solution of claim 2, wherein the at least one sheet of graphite has an in-plane thermal conductivity of at least about 250 W/m°

K.

4. The solution of claim 2, wherein the at least one sheet of graphite has a through-plane thermal conductivity of no greater than about 12 W/m°

K.

5. The solution of claim 1, wherein the housing layers comprise a plastic material, a metal material or combinations thereof.

6. The solution of claim 1, wherein the equipment is a laptop computer and the thermal solution comprises a portion of the laptop computer case.

7. The solution of claim 2, wherein the sheet of graphite is resin-impregnated.

8. A thermal dissipation and shielding system for an electronic device, comprising:

an electronic device comprising a first component which comprises a heat source;

a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and the exterior of the electronic device,

wherein the thermal solution comprises at least one sheet of compressed particles of exfoliated graphite with a density of at least about 1.1 g/cm³ sandwiched between two layers.

9. The system of claim 8, wherein the thermal solution comprises at least a portion of the housing of the electronic device.

10. The system of claim 9, wherein the at least one sheet of graphite has an in-plane thermal conductivity of at least about 140 W/m°

K.

11. The system of claim 10, wherein the at least one sheet of graphite has an in-plane thermal conductivity of at least about 250 W/m°

K.

12. The system of claim 10, wherein the at least one sheet of graphite has a through-plane thermal conductivity of no greater than about 12 W/m°

K.

13. The system of claim 8, wherein the electronic device is a laptop computer, the first component comprises the hard drive of the laptop computer and the thermal solution comprises a portion of the laptop housing.