Integrated liquid cooling device for electronic components

• US 7,162,887 B2
• Filed: 07/09/2004
• Issued: 01/16/2007
• Est. Priority Date: 07/09/2004
• Status: Expired due to Fees

• Current Assignee: Robert S. Symons
• Original Assignee: Robert S. Symons
• Inventors: Symons, Robert S.
• Primary Examiner(s): Jones; Melvin
• Application Number:
  US10/888,101
• Publication Number:
  US 20060007655A1
• Time in Patent Office: 921 Days
• Field of Search: 622/592, 62/32, 62/33, 62/36, 361/699
• US Class Current: 62/259.2
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An integrated liquid cooling device for electronic components addresses the need for efficient cooling created by ever increasing power densities of electronic components. The integrated liquid cooling device has a housing thermally connected to the electronic component, cooling liquid contained in the housing, a motor immersed in the cooling liquid and mounted to the housing, an impeller driven by the motor, and cooling surfaces on the exterior of the housing. The motor driven impeller creates a turbulent flow in the cooling liquid, which rapidly transfers heat from the electronic component and distributes it throughout the interior of the housing. The cooling surfaces on the exterior of the housing dissipate this heat, either by free or forced convection, into the surrounding environment. Alternately, the integrated liquid cooling device may distribute this heat energy over an equipment case by circulating cooling liquid through a baffled enclosure that provides high velocity cooling liquid flow near the heat generating electronic component. Additional cooling capacity can be gained with the described integrated liquid cooling device by selecting a cooling liquid whose boiling point is near the operating temperature of the electronic component.

Claims

1. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing to produce turbulent motion of the cooling liquid without producing substantial pressure differentials in the cooling liquid.

8. The apparatus of claim 1, wherein the housing is hermetically sealed.

9. The apparatus of claim 1, wherein a package of the at least one heat-producing electronic component forms a part of the housing.

2. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the housing has an interior surface of a shape generated by rotating a line generatrix following an arbitrary path between any two points on an axis about that axis.

3. The apparatus of claim 2, wherein the interior surface of the housing is substantially cylindrical.

4. The apparatus of claim 2, wherein the interior surface of the housing is substantially hat-shaped.

5. The apparatus of claim 2, wherein the interior surface of the housing is substantially dome shaped.

6. The apparatus of claim 2, wherein the interior surface of the housing is substantially spherical.

7. The apparatus of claim 2, wherein the line generatrix comprises at least one feature such that the interior surface of the housing comprises at least one corresponding ridge.

10. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the housing is comprised of a metallic material.

11. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing;

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; and

a volume of compressible gas contained in the housing such that expansion of the cooling liquid compresses the volume of compressible gas.

12. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the housing further comprises a cooling liquid expansion device and wherein the cooling liquid substantially fills the housing.

13. The apparatus of claim 12, wherein the cooling liquid expansion device comprises an expansion bellows.

14. The apparatus of claim 12, wherein the cooling liquid expansion device comprises a flexible diaphragm.

15. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the cooling liquid has a boiling point that is approximately equal to an operating temperature of the electronic component.

16. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the motor and impeller are mounted concentrically with respect to the housing.

17. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the motor is mounted near an area of relatively high heat generation in the housing.

18. The apparatus of claim 17, wherein at least one baffle inside the housing controls the direction of cooling liquid flow.

19. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the motor is a direct-current brushless motor.

20. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the impeller further comprises a plurality of vanes approximately normal to an inside circumference of the housing.

21. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the cooling surfaces comprise a plurality of air-cooled fins.

22. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing; and

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing;

wherein the cooling surfaces comprise a thermally conductive and dissipative electronic equipment case.

23. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing;

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; and

a cooling fluid other than air, wherein the cooling fluid other than air is located outside the housing to cool the cooling surfaces.

24. An apparatus for cooling at least one electronic component comprising:

a housing thermally connected to the electronic component and having cooling surfaces;

cooling liquid contained in the housing;

a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; and

a magnetic shielding layer, wherein the magnetic shielding layer is configured to surround the motor to reduce an external magnetic field generated by an operation of the motor.

25. A method of cooling an electronic component comprising the steps of:

thermally connecting the electronic component to an apparatus comprising;

a housing containing a cooling liquid;

a motor mounted inside the housing;

an impeller driven by the motor; and

cooling surfaces thermally connected to the housing; and

activating the motor of the apparatus to drive the impeller such that the cooling liquid is circulated within the housing to produce turbulent motion of the cooling liquid without producing substantial pressure differentials in the cooling liquid.

26. A method of cooling an electronic component comprising the steps of:

thermally connecting the electronic component to an apparatus comprising;

a housing containing a cooling liquid;

a motor mounted inside the housing;

an impeller driven by the motor; and

cooling surfaces thermally connected to the housing;

activating the motor of the apparatus to drive the impeller such that the cooling liquid is circulated within the housing; and

selecting the cooling liquid to have a boiling point that is approximately equal to an operating temperature of the electronic component.