Design of a wet/wet amplified differential pressure sensor based on silicon piezoresistive technology

• US 7,162,927 B1
• Filed: 12/16/2005
• Issued: 01/16/2007
• Est. Priority Date: 12/16/2005
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Muniraju, Raghavendra, Sadasivan, Saravanan, Selvan, Thirumani A., Shenoy, Gururaj U.
• Primary Examiner(s): Lefkowitz; Edward
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US11/305,676
• Time in Patent Office: 396 Days
• Field of Search: 73700-756, 3612831-2834
• US Class Current: 73/753
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation

Abstract

The invention provides pressure sensors for use in wet environments. A pressure sensor package according to the invention has a housing having a pair of cavities separated by a wall member. Sequentially contained within one cavity is a conductive elastomeric seal pad, a pressure sensor and an elastomeric media seal. A pressure cap is attached to the housing such that the pressure cap and the housing together form a hermetic seal. The pressure cap has a port for admitting a gas under pressure into the first cavity. A signal amplifier is positioned within the second cavity and a cover encloses the signal amplifier within the second cavity. An electrical connector through the wall member forms an electrical connection between the pressure sensor and the signal amplifier. A lead frame extends through the housing and forms electrical connections with the pressure sensor and the signal amplifier.

Claims

1. A pressure sensor package which comprises:

a) a housing having a first cavity and a second cavity within the housing, and a wall member separating the first cavity and the second cavity;

b) a conductive elastomeric pad positioned within the first cavity;

c) a pressure sensor positioned on the conductive elastomeric pad;

d) an elastomeric media seal positioned on the pressure sensor;

e) a pressure cap on the elastomeric media seal, which pressure cap is attached to the housing such that the pressure cap and the housing together form a hermetic seal which prevents the escape or entry of a gas through the hermetic seal;

said pressure cap further having a port therethrough for admitting a gas under pressure into the first cavity;

f) a signal amplifier positioned within the second cavity, and a cover on the second cavity which encloses the signal amplifier within the second cavity;

g) an electrical connector through the wall member forming an electrical connection between the pressure sensor and the signal amplifier;

h) a lead frame comprising a plurality of electrical connectors extending through the housing, said lead frame forming electrical connections with the pressure sensor and the signal amplifier.

2. The pressure sensor package of claim 1 further comprising a second port through the housing for admitting a gas under pressure into the first cavity.

3. The pressure sensor package of claim 1 wherein the lead frame forms an electrical connection between the pressure sensor and a circuit and an electrical connection between the signal amplifier and a circuit.

4. The pressure sensor package of claim 1 further comprising a printed circuit board having at least one circuit thereon;

wherein the lead frame forms an electrical connection between the pressure sensor and a circuit on the printed circuit board and the lead frame forms an electrical connection between the signal amplifier and a circuit on the printed circuit board.

5. The pressure sensor package of claim 1 wherein the pressure cap is attached to the housing by an ultrasonic weld.

6. The pressure sensor package of claim 1 wherein the pressure cap is attached to the housing by a plurality of posts.

7. The pressure sensor package of claim 1 wherein the cover is attached to the housing by an ultrasonic weld.

8. The pressure sensor package of claim 1 wherein the pressure sensor comprises a piezoresistive pressure sensor.

9. The pressure sensor package of claim 1 wherein the signal amplifier comprises an integrated circuit.

10. The pressure sensor package of claim 1 further comprising a thermal conduction channel extending from the first cavity to the second cavity.

11. A method of producing a pressure sensor package which comprises:

a) providing a housing having a first cavity and a second cavity within the housing, and a wall member separating the first cavity and the second cavity;

b) positioning a conductive elastomeric pad within the first cavity;

c) positioning a pressure sensor on the conductive elastomeric pad;

d) positioning an elastomeric media seal on the pressure sensor;

e) attaching a pressure cap to the housing over the elastomeric seal, such that the pressure cap and the housing together form a hermetic seal which prevents the escape or entry of a gas through the hermetic seal;

said pressure cap further having a port therethrough for admitting a gas under pressure into the first cavity;

f) positioning a signal amplifier within the second cavity, and then positioning a cover on the second cavity which encloses the signal amplifier within the second cavity;

g) providing an electrical connector through the wall member and forming an electrical connection between the pressure sensor and the signal amplifier;

h) providing a lead frame comprising a plurality of electrical connectors extending through the housing, and forming electrical connections between the lead frame and the pressure sensor and between the lead frame and the signal amplifier.

12. The method of claim 11 further comprising a second port through the housing for admitting a gas under pressure into the first cavity.

13. The method of claim 11 comprising forming an electrical connection between the lead frame and the pressure sensor and a circuit and forming an electrical connection between the signal amplifier and a circuit.

14. The method of claim 11 further comprising providing a printed circuit board having at least one circuit thereon;

and forming an electrical connection with the lead frame between the pressure sensor and a circuit on the printed circuit board; and

forming an electrical connection with the lead frame between the signal amplifier and a circuit on the printed circuit board.

15. The method of claim 11 comprising attaching the pressure cap to the housing by an ultrasonic weld.

16. The method of claim 11 comprising attaching the pressure cap to the housing by a plurality of posts.

17. The method of claim 11 comprising attaching cover to the housing by an ultrasonic weld.

18. The method of claim 11 wherein the pressure sensor comprises a piezoresistive pressure sensor.

19. The method of claim 11 wherein the signal amplifier comprises an integrated circuit.

20. The method of claim 11 wherein the pressure sensor package further comprises a thermal conduction channel extending from the first cavity to the second cavity.

21. A method of determining the pressure of a fluid which comprises:

i) providing a pressure sensor package which comprises;

a) a housing having a first cavity and a second cavity within the housing, and a wall member separating the first cavity and the second cavity;

b) a conductive elastomeric seal pad positioned within the first cavity;

c) a pressure sensor positioned on the conductive elastomeric pad;

d) an elastomeric media seal positioned on the pressure sensor;

e) a pressure cap on the elastomeric media seal, which pressure cap is attached to the housing such that the pressure cap and the housing together form a hermetic seal which prevents the escape or entry of a gas through the hermetic seal;

said pressure cap further having a port therethrough for admitting a gas under pressure into the first cavity;

f) a signal amplifier positioned within the second cavity, and a cover on the second cavity which encloses the signal amplifier within the second cavity;

g) an electrical connector through the wall member forming an electrical connection between the pressure sensor and the signal amplifier;

h) a lead frame comprising a plurality of electrical connectors extending through the housing, said lead frame forming electrical connections with the pressure sensor and the signal amplifier;

ii) flowing a fluid through the port into the first cavity;

iii) measuring the pressure of the fluid in the cavity with the pressure sensor and issuing an electrical signal corresponding to the measured pressure from the pressure sensor to the signal amplifier;

iv) amplifying the electrical signal corresponding to the measured pressure from the pressure sensor with the signal amplifier to form an amplified signal, and issuing the amplified signal to an electrical connection with the lead frame;

v) presenting indicia corresponding to the measured pressure on a display electrically connected to the lead frame.

22. The method of claim 21 wherein the pressure sensor package further comprises a second port through the housing for admitting a gas under pressure into the first cavity;

flowing a second fluid through the second port into the first cavity; and

step (iii) comprising measuring the differential pressure between the fluid and the second fluid.

23. The method of claim 21 wherein the pressure sensor package further comprises a thermal conduction channel extending from the first cavity to the second cavity.