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Heat treatment jig for semiconductor silicon substrate

  • US 7,163,393 B2
  • Filed: 02/02/2004
  • Issued: 01/16/2007
  • Est. Priority Date: 02/02/2004
  • Status: Expired due to Term
First Claim
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1. A heat treatment jig for a semiconductor silicon substrate comprising:

  • a plate-like heat treatment jig that can carry a silicon substrate comprising;

    a central projecting part, provided at the center of the jig, for supporting a central portion of a backside of the substrate; and

    at least one circular-arc part for supporting the backside of the substrate;

    wherein the circular-arc parts comprise;

    at least one of a plurality of circular-arc parts disposed on the same circle; and

    a plurality of circular-arc parts that are disposed on concentric circles of different radii.

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