Using polydentate ligands for sealing pores in low-k dielectrics
First Claim
1. A method for forming a carbon-containing, porous low-k dielectric layer on a semiconductor substrate, the method comprising:
- providing a carbon containing, porous, low-k dielectric layer on said semiconductor substrate; and
treating the pores of said low-k, porous dielectric layer with a polydentate pore-sealing ligand.
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Accused Products
Abstract
In preferred embodiments, a polydentate pore-sealing ligand is used to seal or repair pores damaged by plasma processing. The polydentate ligand includes bidentate ligands corresponding to the general formula X—CH2—(CH2)n—CH2—X or X—Si(CH3)2—(CH2)n—Si(CH3)2—X. The polydentate ligand also includes tridendate ligands corresponding to the general formula X—CH2—(CH2)m(CXH)(CH2)o—CH2—X or X—Si(CH3)2—(CH2)m(CXH)(CH2)o—Si(CH3)2—X. Alternative embodiments may include single or multiply branched polydentate ligands. Other embodiments include ligands that are cross-linked after attachment to the dielectric. Still other embodiments include a derivatization reaction wherein silanol groups formed by plasma damage are removed and favorable dielectric properties are restored.
395 Citations
46 Claims
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1. A method for forming a carbon-containing, porous low-k dielectric layer on a semiconductor substrate, the method comprising:
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providing a carbon containing, porous, low-k dielectric layer on said semiconductor substrate; and treating the pores of said low-k, porous dielectric layer with a polydentate pore-sealing ligand. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of fabricating a semiconductor device comprising:
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forming an active device on a substrate; depositing a carbon-containing, porous, low-k insulator over the active device; exposing the insulator to a plasma; sealing a plurality of open pores in the carbon-containing, porous, low-k insulator by reacting the plurality of open pores with a polydentate pore-sealing ligand. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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Specification