Thin-film thermoelectric cooling and heating devices for DNA genomic and proteomic chips, thermo-optical switching circuits, and IR tags
First Claim
1. A thermoelectric cooling and heating device comprising:
- a substrate;
a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling, each thermoelectric element including, a thermoelectric material, a Peltier contact contacting the thermoelectric material and configured to form under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact; and
a controller configured to separately control at least a first electrode of a first thermoelectric element and a second electrode of a second thermoelectric element, the controller being further configured to bias the first and second electrodes to provide simultaneous heating of a first portion of the substrate adjacent the first thermoelectric element and cooling of a second portion of the substrate adjacent the second thermoelectric element.
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Accused Products
Abstract
A thermoelectric cooling and heating device including a substrate, a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling such that each thermoelectric element includes a thermoelectric material, a Peltier contact contacting the thermoelectric material and forming under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact. As such, the thermoelectric cooling and heating device selectively biases the thermoelectric elements to provide on one side of the thermolectric device a grid of localized heated or cooled junctions.
141 Citations
77 Claims
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1. A thermoelectric cooling and heating device comprising:
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a substrate; a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling, each thermoelectric element including, a thermoelectric material, a Peltier contact contacting the thermoelectric material and configured to form under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact; and a controller configured to separately control at least a first electrode of a first thermoelectric element and a second electrode of a second thermoelectric element, the controller being further configured to bias the first and second electrodes to provide simultaneous heating of a first portion of the substrate adjacent the first thermoelectric element and cooling of a second portion of the substrate adjacent the second thermoelectric element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59)
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60. A thermoelectric cooling and heating device comprising:
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a substrate; a plurality of thermoelectric elements arranged on one side of the substrate and configured to perform at least one of selective heating and cooling, each thermoelectric element including, a thermoelectric material, a Peltier contact contacting the thermoelectric material and configured to form under electrical current flow at least one of a heated junction and a cooled junction, and electrodes configured to provide current through the thermoelectric material and the Peltier contact; and a surface header contacting said plurality of thermoelectric elements and having a transverse thermal conductivity across a thickness of said surface header which is higher than a lateral thermal conductivity along a plane of the surface header, wherein the surface header comprises a high thermal conductivity material in a low thermal conductivity matrix of a solid material and is patterned on an array grid such that the high thermal conductivity material of the surface header aligns with the thermoelectric elements. - View Dependent Claims (61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77)
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Specification