Dielectric composite material

• US 7,164,197 B2
• Filed: 06/19/2003
• Issued: 01/16/2007
• Est. Priority Date: 06/19/2003
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: O'Bryan, Nelson B., Clough, Robert S., Li, Fuming B., Mao, Guoping, Qu, Shichun
• Primary Examiner(s): WILCZEWSKI, MARY A
• Application Number:
  US10/465,155
• Publication Number:
  US 20040256731A1
• Time in Patent Office: 1,307 Days
• Field of Search: 257/759, 257/760, 257/762, 257/795, 257/789, 257/E23.107, 257/E23.136, 257/E23.161, 257/700, 257/701, 257/702
• US Class Current: 257/700
• CPC Class Codes: C08L 65/00 Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain C08L7/00 - C08L57/00, C08L61/00 take precedence; Compositions of derivatives of such polymers
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0239 Coupling agent for particles using a coupling agent to improve the adhesion between an insulating substrate and a metal H05K3/389
• CPC Class Codes: H05K 3/4626 characterised by the insulating layers or materials H05K3/4688 takes precedence

Abstract

A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Claims

1. An electronic package comprising a non-conductive core layer of dielectric composite material and at least one conductive layer laminated thereto, wherein said dielectric composite material has a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004, wherein the dielectric composite material includes a toughened benzocyclobutene resin, and from about 50% to about 75% by weight of at least one inorganic particulate filler, said resin and said inorganic particulate filler being compatibilized by means of a silane coupling agent.

2. An electronic package according to claim 1 wherein said conductive layer has a thickness of less than about 40 μ

m.

3. An electronic package according to claim 2 wherein said conductive layer is low profile copper having a thickness of up to about 5 μ

m.

4. An electronic package according to claim 1 wherein said at least one inorganic particulate filler is a particulate silica having an average particle size less than or equal to ten percent of the thickness of a layer of the dielectric composite material.

5. An electronic package according to claim 1 wherein said package comprises a core layer.

6. An electronic package according to claim 5 wherein said core layer comprises a polymer selected from the group consisting of liquid crystal polymers, and polyimide polymers.

7. An electronic package according to claim 5 wherein pairs of at least one conductive layer and at least one dielectric layer are disposed symmetrically about the non-conductive core layer.