Load sensor and method of manufacturing the load sensor, paste used for the method, and method of manufacturing the paste
First Claim
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1. A load sensor wherein a crystalline glass layer is formed by 10 to 200 μ
- m in thickness on each side of an elastic metal body while an internal electrode of less than 50 μ
m in thickness is buried therein;
a non-crystalline glass layer is formed by 5 to 100 μ
m in thickness on said crystalline glass layer;
a silver wiring and a strain sensitive resistor are formed by 5 to 50 μ
m in thickness each on said non-crystalline glass layer;
said internal electrode is connected to a part of said wiring via holes formed in said crystalline glass layer and said non-crystalline glass layer; and
a protective layer of 200 μ
m or less in thickness is formed so as to cover at least said strain sensitive resistor.
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Abstract
The present invention relates to a load sensor and provides a highly accurate load sensor with multi-layered wiring at low costs. It provides crystallized glass and non-crystalline glass which are best for a load sensor, and combines these to form multi-layered wiring, and further, makes a glass layer of composite type as needed, and reduces uneven printing in printing multiple layers with use of hardening type paste.
17 Citations
1 Claim
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1. A load sensor wherein a crystalline glass layer is formed by 10 to 200 μ
- m in thickness on each side of an elastic metal body while an internal electrode of less than 50 μ
m in thickness is buried therein;a non-crystalline glass layer is formed by 5 to 100 μ
m in thickness on said crystalline glass layer;a silver wiring and a strain sensitive resistor are formed by 5 to 50 μ
m in thickness each on said non-crystalline glass layer;said internal electrode is connected to a part of said wiring via holes formed in said crystalline glass layer and said non-crystalline glass layer; and a protective layer of 200 μ
m or less in thickness is formed so as to cover at least said strain sensitive resistor.
- m in thickness on each side of an elastic metal body while an internal electrode of less than 50 μ
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Current AssigneeMatsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
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Original AssigneeMatsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
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InventorsNakao, Keiichi, Ishida, Hiroaki, Mizukami, Yukio, Katsumata, Masaaki
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Primary Examiner(s)HOANG, TU BA
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Application NumberUS10/499,886Publication NumberTime in Patent Office1,258 DaysField of Search338/2, 338/4, 338/13, 338/36, 338/42, 338/47, 338/114, 338/308, 501/20, 501/21, 505/100, 428/210, 737/21, 737/18, 361/283US Class Current338/47CPC Class CodesG01G 19/4142 for controlling activation ...G01L 1/2287 constructional details of t...H01C 17/06533 composed of oxides
