Packaging for an interferometric modulator
First Claim
Patent Images
1. A method of packaging interferometric modulator arrays into individual devices, comprising:
- providing a transparent substrate;
manufacturing interferometric modulator arrays on a back side of the substrate;
providing a back plate;
providing a desiccant;
sealing the back plate to the backside of the substrate with a back seal, thereby forming multiple packages, wherein said desiccant is sealed inside said multiple packages;
hardening the back seal;
scribing the substrate between multiple packages; and
breaking the substrate into individual devices.
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Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package
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Citations
39 Claims
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1. A method of packaging interferometric modulator arrays into individual devices, comprising:
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providing a transparent substrate; manufacturing interferometric modulator arrays on a back side of the substrate; providing a back plate; providing a desiccant; sealing the back plate to the backside of the substrate with a back seal, thereby forming multiple packages, wherein said desiccant is sealed inside said multiple packages; hardening the back seal; scribing the substrate between multiple packages; and breaking the substrate into individual devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 13, 14, 15, 16, 17, 18, 19, 21, 22, 24)
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12. A method of packaging an interferometric modulator array, comprising:
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providing a transparent substrate; manufacturing interferometric modulator arrays on a back side of the substrate; providing a back plate; providing a desiccant; and sealing the back plate to the backside of the substrate with a back seal, thereby forming a package, wherein said desiccant is sealed inside said package, wherein providing a back plate further comprises providing a sheet of foil with integral spacer posts such that the spacer posts lie between multiple interferometric modulator arrays on the transparent substrate.
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20. A method of packaging interferometric modulator array devices, comprising:
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providing a transparent substrate; manufacturing interferometric modulator arrays on a back side of the substrate; providing a back plate; providing a desiccant; sealing the back plate to the backside of the substrate with a back seal, thereby forming multiple packages, wherein said desiccant is sealed inside said multiple packages; scribing the substrate between multiple packages; and breaking the substrate into individual devices, wherein sealing the back plate to the transparent substrate comprises forming a seal line wide enough such that the seal is not broken when the substrate is scribed and broken.
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23. A method of packaging an interferometric modulator, comprising:
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providing a transparent substrate; manufacturing an interferometric modulator on a back side of the substrate; providing a back plate; providing a desiccant; and sealing the back plate to the backside of the substrate with a back seal, thereby forming a package, wherein said desiccant is sealed inside said package, wherein sealing the back plate to the transparent substrate further comprises sealing the back plate to the transparent substrate in an environment having an initial vacuum, where environmental pressure increases from vacuum to a higher pressure as sealing occurs such that, as pressure in the package increases due to reduced volume, increased environmental pressure aids in creating a good seal. - View Dependent Claims (25, 30)
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26. A method of packaging an interferometric modulator, comprising:
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providing a transparent substrate; manufacturing an interferometric modulator on a back side of the substrate; providing a back plate; providing a desiccant; and sealing the back plate to the backside of the substrate with a back seal, thereby forming a package, wherein said desiccant is sealed inside said package, wherein sealing the back plate to the transparent substrate further comprises sealing the back plate to the transparent substrate in an environment having an initial pressure higher than vacuum up to an including ambient pressure, where environmental pressure then increases to a higher pressure than the initial pressure as sealing occurs such that, as pressure in the package increases due to reduced volume, increased environmental pressure aids in creating a good seal. - View Dependent Claims (31)
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27. A method of packaging an interferometric modulator, comprising:
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providing a transparent substrate; manufacturing an interferometric modulator on a back side of the substrate; providing a back plate; providing a desiccant; and sealing the back plate to the backside of the substrate with a back seal, thereby forming a package, wherein said desiccant is sealed inside said package, wherein sealing the back plate to the transparent substrate further comprises sealing the back plate to the transparent substrate in an environment having a pressure higher than ambient pressure to form the seal. - View Dependent Claims (28)
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29. A method of packaging an interferometric modulator, comprising:
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providing a transparent substrate; manufacturing an interferometric modulator on a back side of the substrate; providing a back plate; providing a desiccant; and sealing the back plate to the backside of the substrate with a back seal, thereby forming a package, wherein said desiccant is sealed inside said package, wherein sealing the back plate to the transparent substrate further comprises sealing the back plate to the transparent substrate in an environment having an initial environmental pressure higher than ambient pressure, wherein the environmental pressure then increases to a higher pressure than the initial pressure as sealing occurs such that, as pressure in the package increases due to reduced volume, increased environmental pressure aids in creating a good seal. - View Dependent Claims (32)
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33. A method of packaging interferometric modulator display devices, comprising:
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providing a display panel comprising a transparent substrate, a plurality of interferometric modulator arrays formed on said transparent substrate, and a back plate sealed to said transparent substrate by a back seal to form multiple display panel packages; hardening the back seal; scribing the display panel between the multiple display panel packages; and breaking the display panel into individual devices. - View Dependent Claims (34, 35, 36, 37, 38, 39)
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Specification