Plenum-based computer cooling system

• US 7,164,580 B2
• Filed: 03/25/2003
• Issued: 01/16/2007
• Est. Priority Date: 03/25/2003
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: DiStefano, Eric
• Primary Examiner(s): CHANG, YEAN HSI
• Application Number:
  US10/397,985
• Publication Number:
  US 20040190243A1
• Time in Patent Office: 1,393 Days
• Field of Search: 361/687, 361690-692, 361/695, 361717-719, 361/683, 165 802- 803, 165/121
• US Class Current: 361/679.49
• CPC Class Codes: G06F 1/20 Cooling means

Abstract

A system for using a plenum to cool components of the system is described. The plenum distributes air to local hot spots of the system which are remote from a fan source. A central processing fan, a separate system fan, or an external air source may be used to generate the air to be distributed.

Claims

1. A computer system, comprising:

a first component and a second component;

a motherboard coupled to the first component and the second component, wherein the motherboard enables communication between the first component and the second component;

a plenum having a first orifice directly over the first component and a second orifice directly over the second component, wherein the plenum distributes air to cool the first component and the second component, wherein the predominant flow of air is substantially perpendicular to the plane of the motherboard and directed onto the surface of the first and second components;

a first sensor to detect a temperature of the first component;

a second sensor to detect a temperature of the second component; and

an air source, coupled to the plenum and the sensor, to pressurize the plenum with air, wherein the air source increases the plenum air pressure if the first component has a temperature above a first cooling requirement or if the second component has a temperature above a second cooling requirement, and wherein the air source maintains the plenum air pressure if the first component temperature is not above the first cooling requirement and if the second component temperature is not above the second cooling requirement.

2. The computer system of claim 1, wherein a size of the first and second orifices depend on the first and second cooling requirements, respectively.

3. The computer system of claim 1, wherein the air source is a compressor.

4. The computer system of claim 3, wherein the air source generates refrigerated air.

5. The computer system of claim 1, wherein the air source is a fan.

6. The computer system of claim 1, wherein the first component is a central processing unit.

7. The computer system of claim 1, wherein the second component is a chipset.

8. The computer system of claim 1, further comprising a memory coupled to the motherboard, wherein the plenum comprises a third orifice over the memory to cool the memory.

9. The computer system of claim 1, wherein the plenum comprises plastic.

10. The computer system of claim 9, wherein the plenum comprises a material selected from group consisting of polyester, Mylar, and any combination thereof.

11. The computer system of claim 1, wherein the system is a laptop computer.

12. The computer system of claim 1, wherein the system is a desktop computer.

13. The computer system of claim 1, wherein the location of at least one orifice is directly above a component and off-centered in a direction upwind from an exhaust port.

14. The computer system of claim 1, wherein the sensor comprises a thermostat.

15. The computer system of claim 1, wherein the predominant flow of air substantially perpendicular to the surface of at least one component results in turbulent flow over the surface of the at least one component.

16. An apparatus, comprising:

a means for distributing air to local hot spots of a computer system, which are located on at least one or more planes and remote from an air source, wherein the distributed air predominantly flows substantially perpendicular to the at least one or more planes of the hot spots;

a means for sensing temperatures of each of the local hot spots;

a means for increasing air flow if at least one of the local hot spots has a temperature above a cooling requirement; and

a means for maintaining air flow if each of the local hot spots have temperatures not above their respective cooling requirements.

17. The apparatus a claim 16, further comprising a means for forming in a plenum, at least one or more orifices directly over at least one or more of the local hot spots which require cooling.

18. The apparatus a claim 16, wherein the means for distributing air to local hot spots are proportional to the cooling requirements of the local hot spots.

19. The apparatus a claim 16, wherein the means for distributing air generates turbulent flow on at least one or more surfaces of the local hot spots.

20. The apparatus a claim 16, further comprising:

a means for generating air to distribute to the local hot spots.

21. A method, comprising:

providing a computer system having a plurality of components;

determining at least two or more components of the computer system that require cooling;

forming at least two or more orifices in a plenum directly over the at least two or more components that require cooling;

sensing temperatures of each of the at least two or more components that require cooling;

pressurizing the plenum with air to cool the components by flowing air from the plenum directly onto the at least two or more components requiring cooling;

determining if the components to be cooled are being adequately cooled, as measured by their respective sensed temperatures;

increasing the air pressure of the plenum if at least one of the components that requires cooling is not being adequately cooled, as measured by its sensed temperature; and

maintaining the air pressure of the plenum if all the components requiring cooling are being adequately cooled, as measured by their respective temperatures.

22. The method of claim 21, wherein the size of each orifice depends on the cooling requirement of each corresponding component requiring cooling.

23. The method of claim 21, wherein at least one or more orifices generate air flow which is predominantly perpendicular to and directed toward the surface of the component requiring cooling.

24. The method of claim 23, wherein the air flow perpendicular to the surface of at least one or more component requiring cooling comprise turbulent air flow on the surface of the at least one or more components requiring cooling.