Plenum-based computer cooling system
First Claim
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1. A computer system, comprising:
- a first component and a second component;
a motherboard coupled to the first component and the second component, wherein the motherboard enables communication between the first component and the second component;
a plenum having a first orifice directly over the first component and a second orifice directly over the second component, wherein the plenum distributes air to cool the first component and the second component, wherein the predominant flow of air is substantially perpendicular to the plane of the motherboard and directed onto the surface of the first and second components;
a first sensor to detect a temperature of the first component;
a second sensor to detect a temperature of the second component; and
an air source, coupled to the plenum and the sensor, to pressurize the plenum with air, wherein the air source increases the plenum air pressure if the first component has a temperature above a first cooling requirement or if the second component has a temperature above a second cooling requirement, and wherein the air source maintains the plenum air pressure if the first component temperature is not above the first cooling requirement and if the second component temperature is not above the second cooling requirement.
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Abstract
A system for using a plenum to cool components of the system is described. The plenum distributes air to local hot spots of the system which are remote from a fan source. A central processing fan, a separate system fan, or an external air source may be used to generate the air to be distributed.
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Citations
24 Claims
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1. A computer system, comprising:
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a first component and a second component; a motherboard coupled to the first component and the second component, wherein the motherboard enables communication between the first component and the second component; a plenum having a first orifice directly over the first component and a second orifice directly over the second component, wherein the plenum distributes air to cool the first component and the second component, wherein the predominant flow of air is substantially perpendicular to the plane of the motherboard and directed onto the surface of the first and second components; a first sensor to detect a temperature of the first component; a second sensor to detect a temperature of the second component; and an air source, coupled to the plenum and the sensor, to pressurize the plenum with air, wherein the air source increases the plenum air pressure if the first component has a temperature above a first cooling requirement or if the second component has a temperature above a second cooling requirement, and wherein the air source maintains the plenum air pressure if the first component temperature is not above the first cooling requirement and if the second component temperature is not above the second cooling requirement. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An apparatus, comprising:
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a means for distributing air to local hot spots of a computer system, which are located on at least one or more planes and remote from an air source, wherein the distributed air predominantly flows substantially perpendicular to the at least one or more planes of the hot spots; a means for sensing temperatures of each of the local hot spots; a means for increasing air flow if at least one of the local hot spots has a temperature above a cooling requirement; and a means for maintaining air flow if each of the local hot spots have temperatures not above their respective cooling requirements. - View Dependent Claims (17, 18, 19, 20)
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21. A method, comprising:
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providing a computer system having a plurality of components; determining at least two or more components of the computer system that require cooling; forming at least two or more orifices in a plenum directly over the at least two or more components that require cooling; sensing temperatures of each of the at least two or more components that require cooling; pressurizing the plenum with air to cool the components by flowing air from the plenum directly onto the at least two or more components requiring cooling; determining if the components to be cooled are being adequately cooled, as measured by their respective sensed temperatures; increasing the air pressure of the plenum if at least one of the components that requires cooling is not being adequately cooled, as measured by its sensed temperature; and maintaining the air pressure of the plenum if all the components requiring cooling are being adequately cooled, as measured by their respective temperatures. - View Dependent Claims (22, 23, 24)
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Specification