×

Modular heatsink, electromagnetic device incorporating a modular heatsink and method of cooling an electromagnetic device using a modular heatsink

  • US 7,164,584 B2
  • Filed: 10/19/2004
  • Issued: 01/16/2007
  • Est. Priority Date: 10/19/2004
  • Status: Expired due to Fees
First Claim
Patent Images

1. A heatsink comprising a plurality of U-shaped heatsink elements each comprising first and second legs having a first thickness connected by a base having a second thickness greater than said first thickness, the base of each of said plurality of heatsink elements being in contact with the base of an adjacent heatsink element.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×