Modular heatsink, electromagnetic device incorporating a modular heatsink and method of cooling an electromagnetic device using a modular heatsink

• US 7,164,584 B2
• Filed: 10/19/2004
• Issued: 01/16/2007
• Est. Priority Date: 10/19/2004
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Walz, Andrew A.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US10/968,750
• Publication Number:
  US 20060082945A1
• Time in Patent Office: 819 Days
• Field of Search: None
• US Class Current: 361/704
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 27/266 Fastening or mounting the core on casing or support on coil H01F27/30
• CPC Class Codes: H01F 27/2847 Sheets; Strips H01F27/2866 takes precedence

Abstract

An electromagnetic device (10) includes a core (12) having first and second arms (16, 18) connected by at least one body (14), a first winding (40) having multiple turns (41a, 41b) on the first arm (16) and a second winding (42) having multiple turns (43a, 43b) on the second arm (18), and a heatsink (50) having a first plurality of U-shaped heatsink elements (52) each including first and second legs (56, 58) aligned with the first and second arms (16, 18) and having a first thickness connected by a base (54) having a second thickness greater than the first thickness, the base (54) of each of the plurality of elements (52) being in contact with the base (54) of an adjacent heatsink element (52).

Claims

1. A heatsink comprising a plurality of U-shaped heatsink elements each comprising first and second legs having a first thickness connected by a base having a second thickness greater than said first thickness, the base of each of said plurality of heatsink elements being in contact with the base of an adjacent heatsink element.

2. The heatsink of claim 1 wherein said first leg of each of said plurality of heatsink elements is spaced from the first leg of an adjacent heatsink element.

3. The heatsink of claim 2 wherein said first legs of said heatsink elements are substantially planar and parallel to one another.

4. The heatsink of claim 1 wherein the first leg of one of said heatsink elements is parallel to the second leg of said one of said heatsink elements.

5. The heatsink of claim 1 including a heat conducting sheet associated with the base of one of said heatsink elements.

6. The heatsink of claim 5 wherein said heatsink and said heat conducting sheet are formed from the same material.

7. The heatsink of claim 1 wherein said base includes a folded portion forming said second thickness.

8. The heatsink of claim 1 wherein the first leg of one of said heatsink elements has a first length and the second leg of said one of said heatsink elements has a second length substantially equal to said first length.

9. The heatsink of claim 1 wherein said first leg extends substantially perpendicularly from said base.

10. The heatsink of claim 9 wherein said heatsink elements are formed from copper or aluminum.

11. A method of cooling an electromagnetic device comprising a core having first and second arms connected by a body with a first winding having multiple turns around said first arm and a second winding having multiple turns around said second arm comprising the steps of:

providing a plurality of heatsink elements each comprising a base having a first thickness and first and second legs having a second thickness less than the first thickness extending from the base,

arranging a first one of the heatsink elements with the first leg of the first heatsink element between the first arm of the core and a portion of the first winding and the second leg of the first heatsink element between the second arm of the core and a portion of the second winding;

arranging a second one of the heatsink elements with the first leg of the second heatsink element between a first and a second turn of the first winding and the second leg of the second one of the heatsink elements between a first and a second turn of the second winding; and

holding the bases of the heatsink elements in thermal contact.

12. The method of claim 11 including the additional step of holding at least one of the heatsink elements against a secondary heatsink.

13. The method of claim 12 including the additional step of attaching the core to the secondary heatsink.

14. The method of claim 13 wherein said step of attaching the core to the secondary heatsink comprises the step of inserting a fastener though a portion of the core, through at least one of the heatsink elements and into the secondary heatsink.

15. The method of claim 12 including the additional step of arranging a third one of the heatsink elements with the first leg of the third heatsink element between the second and a third turn of the first winding and the second leg of the third heatsink element between the second and a third turn of the second winding.

16. The method of claim 11 wherein said step of arranging a first one of the heatsink elements with the first leg of the first heatsink element between the first arm of the core and a portion of the first winding and the second leg of the first heatsink element between the second arm of the core and a portion of the second winding comprises the step of arranging the first leg of the heatsink element in contact with the first arm of the core.

17. An electromagnetic device comprising a core having first and second arms connected by at least one body, a first winding comprising multiple turns on said first arm and a second winding comprising multiple turns on said second arm, and a heatsink comprising a first plurality of U-shaped heatsink elements each comprising first and second legs aligned with said first and second arms and having a first thickness connected by a base having a second thickness greater than said first thickness, the base of each of said plurality of elements being in contact with the base of an adjacent heatsink element.

18. The electromagnetic device of claim 17 wherein said first legs of said first plurality of heatsink elements are substantially parallel to one another and to said first arm.

19. The electromagnetic device of claim 17 wherein said first arm is substantially parallel to said second arm and the first leg of one of said first plurality of heatsink elements is parallel to the second leg of said one of said first plurality of heatsink elements.

20. The electromagnetic device of claim 17 wherein each heatsink element includes a heat conductive sheet attached to the base of said heatsink element.

21. The electromagnetic device of claim 17 wherein said at least one body comprises first and second bodies and including a second plurality of U-shaped heatsink elements each comprising first and second legs aligned with first and second arms of said second body and having a first thickness connected by a base having a second thickness greater than said first thickness, said bases of said second plurality of heatsink elements being aligned with said second body.

22. The electromagnetic device of claim 17 wherein said at least one body includes a hole, said U-shaped heatsink elements include holes aligned with the hole in the at least one body, and a fastener extending through said body hole and said heatsink element hole and into a secondary heatsink.

23. A heatsink comprising a plurality of U-shaped heatsink elements each comprising first and second legs connected by a base and a plurality of spacers spacing the base of each heatsink element from the base of an adjacent heatsink element and leaving a gap between the first leg of each heatsink element and the first leg of an adjacent heatsink element, the base of each of said plurality of heatsink elements being in thermal contact with the base of each adjacent heatsink element through said spacers.

24. The heatsink of claim 23 wherein said spacer comprises a metallic element connected to said base.

25. The heatsink of claim 23 wherein said spacer comprises a folded portion of said heatsink element.

26. The heatsink of claim 24 wherein each of said metallic elements is connected to at least one heatsink base.