Integrated liquid cooling device with immersed electronic components
First Claim
1. An apparatus for cooling at least one electronic component comprising:
- a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled;
a cooling liquid contained in the housing; and
a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing to produce turbulent motion of the cooling liquid without producing substantial pressure differentials in the cooling liquid.
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Accused Products
Abstract
An integrated liquid cooling device for electronic components addresses the need for efficient cooling created by ever increasing power densities of electronic components. The integrated liquid cooling device has a housing enclosing the electronic component, cooling liquid contained in the housing, a motor immersed in the cooling liquid and mounted to the housing, an impeller driven by the motor, and cooling surfaces on the exterior of the housing. The motor driven impeller creates a turbulent flow in the cooling liquid and a high velocity liquid flow over the electronic component, which rapidly transfers heat from the electronic component and distributes it throughout the interior of the housing. The cooling surfaces on the exterior of the housing dissipate this heat, either by free or forced convection, into the surrounding environment. Alternately, the integrated liquid cooling device may distribute this heat energy over an equipment case by circulating cooling liquid through a baffled enclosure that provides high velocity cooling liquid flow near the heat generating electronic component. Additional cooling capacity can be gained with the described integrated liquid cooling device by selecting a cooling liquid whose boiling point is near the operating temperature of the electronic component.
60 Citations
40 Claims
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1. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; and a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing to produce turbulent motion of the cooling liquid without producing substantial pressure differentials in the cooling liquid. - View Dependent Claims (2, 3, 4, 11, 12, 13, 20, 21, 22, 23, 24, 25, 26)
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5. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; and a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; wherein the housing has an interior surface having a shape defined by rotating a line generatrix following an arbitrary path between any two points on an axis about that axis. - View Dependent Claims (6, 7, 8, 9, 10)
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14. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; and a volume of compressible gas contained in the housing such that expansion of the cooling liquid compresses the volume of compressible gas.
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15. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; and a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; wherein the housing further comprises a cooling liquid expansion device and wherein the cooling liquid substantially fills the housing. - View Dependent Claims (16, 17)
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18. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; and a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; wherein the cooling liquid has a boiling point that is approximately equal to an operating temperature of the electronic component.
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19. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; and a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; wherein the motor and impeller are mounted concentrically with respect to the housing.
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27. An apparatus for cooling at least one electronic component comprising:
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a housing having cooling surfaces and having an internal mounting space adapted to mount therein at least one electronic component to be cooled; a cooling liquid contained in the housing; a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing; and a magnetic shielding layer configured to surround the motor to reduce an external magnetic field generated by an operation of the motor.
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28. An apparatus for cooling at least one high power density electronic component comprising:
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a housing having cooling surfaces and a space configured to mount therein at least one high power density electronic component to be cooled; cooling liquid contained in the housing; and at least one motor mounted inside the housing and having an impeller operatively coupled thereto, the impeller being driven by the motor to circulate the cooling liquid within the housing to produce turbulent motion of the cooling liquid without producing substantial pressure differentials in the cooling liquid. - View Dependent Claims (29, 34, 35, 37, 38)
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30. An apparatus for cooling at least one high power density electronic component comprising:
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a housing having cooling surfaces and a space configured to mount therein at least one high power density electronic component to be cooled; cooling liquid contained in the housing; at least one motor mounted inside the housing and having an impeller operatively coupled thereto, the impeller being driven by the motor to circulate the cooling liquid within the housing; and at least one baffle mounted inside the housing and forming a partial enclosure around the motor and the impeller; wherein the at least one high power density electronic component is mounted inside the housing at a location enclosed by the partial enclosure formed by the at least one baffle. - View Dependent Claims (31, 32, 33)
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36. An apparatus for cooling at least one high power density electronic component comprising:
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a housing having cooling surfaces and a space configured to mount therein at least one high power density electronic component to be cooled, the housing further comprising a first housing portion and a second housing portion; cooling liquid contained in the housing; and at least one motor mounted inside the housing and having an impeller operatively coupled thereto, the impeller being driven by the motor to circulate the cooling liquid within the housing; wherein the second housing portion is comprised of a material selected from the group of a partially metallized plastic, a partially metallized glass, or a partially metallized ceramic.
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39. A method of cooling an electronic component comprising the steps of:
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enclosing the electronic component in a housing containing a cooling liquid; and circulating the cooling liquid within the housing to produce turbulent motion of the cooling liquid without producing substantial pressure differentials in the cooling liquid.
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40. A method of cooling an electronic component comprising the steps of:
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enclosing the electronic component in a housing containing a cooling liquid; and circulating the cooling liquid within the housing, wherein the cooling liquid has a boiling point that is approximately equal to an operating temperature of the electronic component.
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Specification