Surface acoustic wave sensor methods and systems

• US 7,165,455 B2
• Filed: 12/18/2004
• Issued: 01/23/2007
• Est. Priority Date: 12/18/2004
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Liu, James Z., Cook, James D., Magee, Steven J.
• Primary Examiner(s): Williams; Hezron
• Assistant Examiner(s): MILLER, ROSE MARY
• Application Number:
  US11/017,171
• Publication Number:
  US 20060130585A1
• Time in Patent Office: 766 Days
• Field of Search: 310/313.R, 310/313.B
• US Class Current: 73/650
• CPC Class Codes: G01L 1/165 with acoustic surface waves
• CPC Class Codes: G01L 3/10 involving electric or magnetic means for indicating
• CPC Class Codes: G01L 9/0025 with acoustic surface waves

Abstract

Sensor systems and methods are disclosed herein, including a sensor chip, upon which at least two surface acoustic wave (SAW) sensing elements are centrally located on a first side (e.g., front side) of the sensor chip. The SAW sensing elements occupy a common area on the first side of the sensor chip. An etched diaphragm is located centrally on the second side (i.e., back side) of the sensor chip opposite the first side in association with the two SAW sensing elements in order to concentrate the mechanical strain of the sensor system or sensor device in the etched diagram, thereby providing high strength, high sensitivity and ease of manufacturing thereof.

Claims

1. A sensor method, comprising the steps of:

providing a substrate comprising swept quartz;

locating at least two surface acoustic wave (SAW) sensing elements located centrally on a first side of said substrate, wherein said at least two SAW sensing elements occupy a common area on said first side of said substrate and wherein said at least two SAW sensing elements comprise interdigital transducers thereof; and

etching a cavity centrally on a second side of said substrate opposite said first side in association with said at least two SAW sensing elements, wherein said etched cavity forms an etched diaphragm on and from said substrate in order to concentrate a mechanical strain in said etched diagram, thereby providing a high strength, high sensitivity sensor system with ease of manufacturing thereof.

2. The method of claim 1 further comprising the step of arranging said at least two SAW sensing elements in a delay line configuration.

3. The method of claim 1 further comprising the step of arranging said at least two SAW sensing elements in a resonator configuration.

4. The method of claim 1 further comprising the step of etching said cavity on said second side of said sensor chip utilizing a wet etchant.

5. The method of claim 1 further comprising the step of etching said cavity on said second side of said sensor chip utilizing a dry etchant.

6. The method of claim 1 further comprising the step of mechanically etching said cavity on said second side of said sensor chip.

7. The method of claim 1 further comprising the steps of:

configuring said at least two SAW sensing elements to comprise a first SAW sensor and a second SAW sensor,

associating a first set of reflectors with said first SAW sensor and a second set of reflectors with said second SAW sensor on said first side of said sensor chip; and

configuring said first and said second set of reflectors upon said etched diaphragm.

8. A sensor system, comprising:

a quartz substrate;

an etched cavity formed on a first side of said substrate, wherein said etched cavity forms an etched diaphragm on and from said substrate in order to concentrate a mechanical strain in said etched diaphragm;

a plurality of surface acoustic wave (SAW) sensing elements located on a second side of said substrate opposite said first side, wherein a first SAW sensing element of said plurality of SAW sensing elements is located on said etched diaphragm, thereby combining a high strength, high sensitivity sensor system with ease of manufacturing.

9. The system of claim 8 further comprising:

a second SAW sensing element of said plurality of SAW sensing elements, wherein said second SAW resonator is not influenced by torque; and

a third SAW sensing element of said plurality of SAW sensing elements wherein said third sensing element is Influenced only by temperature.

10. The system of claim 9, further comprising:

a package base bonded to said substrate;

a second etched cavity formed on said package base on the side opposite to said substrate in order to maximize said mechanical strain in said etched diaphragm on said substrate;

a wall formed upon said package base, wherein said wall surrounds said substrate, said etched diaphragm, and said plurality of said SAW sensing elements; and

a cover bonded to said wall, wherein said wall and said cover enclose and seal said substrate, said etched diaphragm, and said plurality of said SAW sensing elements upon said package base.

11. The system of claim 10, wherein said etched cavity is etched utilizing an etching method selected from the group consisting of wet etching, dry etching and mechanical etching.

12. The system of claim 8, wherein a second SAW sensing element of said plurality of SAW sensing elements is located upon said etched diaphragm, wherein the signal polarity of said first SAW sensing element is opposite the signal polarity of said second SAW sensing element.

13. The system of claim 8, further comprising:

a second SAW sensing element of said plurality of sensing elements, wherein said first and said second SAW sensing elements are centrally located and, wherein said first and said second SAW sensing elements occupy a common area upon said etched diaphragm; and

a first set of a plurality of reflectors associated with said first SAW sensing element and a second set of a plurality of reflectors associated with said second SAW sensing element.

14. The system of claim 13, wherein said first and second SAW sensing elements are arranged in a delay line configuration.

15. The system of claim 13, wherein said first and said second SAW sensing elements are arranged in a resonator configuration.

16. The system of claim 13, wherein said etched cavity is etched in said substrate by an etching method selected form the group consisting of wet etching and dry etching.

17. A sensor system, comprising:

a substrate;

a plurality of surface acoustic wave (SAW) sensing elements located upon said substrate wherein each SAW sensing element of said plurality of SAW sensing elements has a first side and a second side; and

an etched cavity formed on a first side of said each SAW sensing element, wherein said etched cavity forms an etched diaphragm on said each SAW element in order to concentrate a mechanical strain in said etched diaphragm, thereby combining a high strength, high sensitivity sensor system with ease of manufacturing.

18. The system of claim 17 wherein said substrate is formed as a shaft, and wherein said plurality of SAW sensing elements are configured in a half-bridge configuration.

19. The system of claim 17 wherein said plurality of SAW sensing elements is configured In a half-bridge configuration.

20. The system of claim 19 wherein a first SAW sensing element of said plurality of SAW sensing elements is under a compressive strain and a second SAW sensing element of said plurality of SAW sensing elements is under a tensile strain.

21. The system of claim 20 wherein at least one frequency from said first SAW sensing element and at least one frequency from second SAW sensing elements are mixed to produce a difference and a sum.

22. The system of claim 21 wherein said difference is utilized for torque sensing.

23. The system of claim 22 wherein said sum is utilized for temperature sensing.