Heat sink structure

• US 7,165,602 B2
• Filed: 09/02/2004
• Issued: 01/23/2007
• Est. Priority Date: 09/18/2003
• Status: Expired due to Fees

• Current Assignee: Chicony Power Technology Co. Ltd. (Chicony Electronics Company Limited)
• Original Assignee: Hipro Electronics Company Limited (Chicony Electronics Company Limited)
• Inventors: Wang, Chia Hua
• Primary Examiner(s): Flanigan; Allen J.
• Application Number:
  US10/932,094
• Publication Number:
  US 20050061475A1
• Time in Patent Office: 873 Days
• Field of Search: 165/80.3, 165/104.33, 165/104.34, 165/185, 361/697, 361/704
• US Class Current: 165/80.2
• CPC Class Codes: H05K 7/20518 Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Abstract

The present invention provides a heat sink structure, which includes: a housing located on a material with low thermal conductivity; and a heat conductor placed inside the housing. At least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing, and thus increasing the thermal resistance between the heat conductor and the housing. The surface temperature of the bottom of the housing thus could be reduced and averaged, so as to effectively improve the lifespan, the safety and reliability of a device with the heat sink structure.

Claims

1. A heat sink structure, including:

a housing; and

a heat conductor enclosed and surrounded by said housing, said heat conductor being configured with a flange on a bottom thereof and a pair of vertical portions upwardly extending respectively from two opposite sides of the bottom of said heat conductor such that said vertical portions of said heat conductor are abutted against portions of said housing;

wherein by overlapping said flange of said heat conductor on said housing at least one air gap is formed therebetween.

2. The heat sink structure of claim 1, wherein the material of said heat conductor is material with good thermal conductivity.

3. The heat sink structure of claim 2, wherein the material of said heat conductor is Aluminum or Copper.

4. The heat sink structure of claim 1, wherein the air gap is filled with a material with low thermal conductivity, selected from foam and vesicant material.