Magnetron sputtering systems including anodic gas distribution systems

• US 7,166,199 B2
• Filed: 12/18/2002
• Issued: 01/23/2007
• Est. Priority Date: 12/18/2002
• Status: Active Grant

• Current Assignee: Cardinal CG Company (Cardinal Glass Industries Incorporated)
• Original Assignee: Cardinal CG Company (Cardinal Glass Industries Incorporated)
• Inventors: Hartig, Klaus
• Primary Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US10/323,703
• Publication Number:
  US 20040118678A1
• Time in Patent Office: 1,497 Days
• Field of Search: 204/192.12, 204/298.07, 204/298.08, 204/298.14, 204/298.19, 204/298.2, 204/298.21, 204/298.22
• US Class Current: 204/192.12
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: C23C 14/56 Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering

Abstract

The present invention provides a magnetron sputtering system using a gas distribution system which also serves as a source of anodic charge to generate plasma field. The sputtering system is comprised of a vacuum chamber, a cathode target of sputterable material, a power source which supplies positive and negative charge, and a gas distribution system. The gas distribution system may comprise a simple perforated gas delivery member, or it may comprise a perforated gas delivery member with an attached conductive anodic surface. The gas delivery member may also contain an inner conduit with further perforations which serves to baffle flow of the sputtering gas. Gas flow may be regulated within discrete portions of the gas distribution system. The anodic surfaces of the gas distribution system are cleaned through the action of plasma and gas flow, creating a more stable plasma and reducing the need for maintenance.

Claims

1. A magnetron sputtering apparatus for applying thin films on substrates, comprising:

a vacuum chamber within which a controlled environment may be established;

one or more cathode assemblies including a target comprising one or more sputterable target materials;

a gas distribution system operatively connected to one or more gas supplies and including one or more gas delivery members each being hollow and each having nozzles through which sputtering gases are introduced into the vacuum chamber;

and one or more power supplies electrically connected to the one or more cathode assemblies and the gas distribution system.

2. The magnetron sputtering apparatus of claim 1 wherein the one or more power supplies are directly connected to a gas conduit or the one or more gas delivery members to deliver a positive charge to said one or more gas delivery members.

3. The magnetron sputtering system of claim 1 wherein the gas distribution system further compnses one or more inner conduits positioned within the one or more gas delivery members.

4. The magnetron sputtering apparatus of claim 3 wherein the one or more inner conduits include a plurality of apertures that are spaced and aligned in a non-overlapping manner relative to the nozzles.

5. The magnetron sputtering apparatus of claim 1 wherein a power source is operatively connected to one or more conductive members that are positioned adjacent to the one or more gas delivery members.

6. The magnetron sputtering apparatus of claim 5 wherein the one or more conductive members are attached to the one or more gas delivery members by non-conductive brackets.

7. The magnetron sputtering apparatus of claim 5 wherein the conductive members include one or more conductive wires.

8. The magnetron sputtering apparatus of claim 1 wherein the gas delivery nozzles face away from the one or more cathode assemblies.

9. The magnetron sputtering apparatus of claim 1 wherein an insulator is interposed between the one or more gas supplies and the one or more gas delivery members.

10. The magnetron sputtering apparatus of claim 1 wherein a plurality of independent gas lines including gas flow controllers operably connect the one or more gas delivery members to the one or more gas supplies.

11. The magnetron sputtering apparatus of claim 10 wherein the one or more gas delivery members include one or more partitions to contain the flow of gas from the independent gas lines in predesignated portions of the one or more gas delivery members.

12. An anodic gas delivery system comprising:

one or more gas delivery members conducively coupled to a power supply to produce at least one anodic surface, the one or more gas delivery members each being hollow and each including nozzles through which one or more sputtering gases are introduced into a deposition chamber;

and a gas conduit through which the sputtering gases are delivered from one or more gas supplies to the one or more gas delivery members.

13. The anodic gas delivery system of claim 12 wherein the anodic gas delivery system further includes one or more inner conduits positioned within the one or more gas delivery members.

14. The anodic gas delivery system of claim 13 wherein the inner conduits include a plurality of apertures that are spaced and aligned in a non-overlapping manner relative to the nozzles.

15. The anodic gas delivery system of claim 12 wherein the one or more sputtering gas is directed to flow away from a cathode assembly.

16. The anodic gas delivery system of claim 12 wherein an insulator is interposed between the one or more gas supplies and the one or more gas delivery members.

17. The anodic gas delivery system of claim 12 wherein gas flow from the one or more gas delivery members may be locally varied by using a plurality of independent gas lines including gas flow controllers operably connecting the one or more gas delivery members to the gas supply.

18. The anodic gas delivery system of claim 17 wherein the gas delivery member includes one or more partitions to contain the flow of gas from the independent gas lines in predesignated portions of the one or more gas delivery members.

19. An anodic gas delivery system comprising:

one or more gas delivery members each being hollow and each including nozzles through which one or more sputtering gases are introduced into a deposition chamber;

one or more conductive members positioned adjacent to the one or more gas delivery members so as to receive a flow of gas from the one or more gas delivery members and electrically coupled to a power supply to produce at least one anodic surface on the conductive members;

one or more brackets operably adjoined to the one or more conductive members to deliver a charge to the one or more gas delivery members;

and a gas conduit through which the one or more sputtering gases are delivered from one or more gas supplies to the one or more gas delivery members.

20. The anodic gas delivery system of claim 19 wherein the anodic gas delivery system further includes one or more inner conduits positioned within the one or more gas delivery members.

21. The anodic gas delivery system of claim 20 wherein the one or more inner conduits include a plurality of apertures that are spaced and aligned in a non-overlapping manner relative to the nozzles.

22. The anodic gas delivery system of claim 19 wherein the one or more sputtering gases is directed to flow away from cathode assemblies.

23. The anodic gas delivery system of claim 19 wherein an insulator is interposed between the one or more gas supplies and the one or more gas delivery members.

24. The anodic gas delivery system of claim 19 wherein gas flow from the one or more gas delivery members may be locally varied by using a plurality of independent gas lines including gas flow controllers operably connecting the one or more gas delivery members to the one or more gas supplies.

25. The anodic gas delivery system of claim 24 wherein the one or more gas delivery members includes one or more partitions to contain the flow of gas from the independent gas lines in predesignated portions of the one or more gas delivery members.

26. The anodic gas delivery system of claim 19 wherein the one or more conductive members is a conductive wire.

27. The anodic gas delivery system of claim 19 wherein the one or more sputtering gases is directed to flow away from cathode assemblies.

28. The anodic gas delivery system of claim 19 wherein the one or more conductive members are adjoined to the one or more gas delivery members with non-conductive brackets.

29. A method of maintaining a conductive anodic surface in a magnetron sputtering system comprising:

introducing one or more gases through at a gas delivery system and into a deposition chamber, said gas delivery system including one or more gas delivery members each being hollow and each having nozzles through which the one or more sputtering gases are introduced into the deposition chamber and one or more gas conduits operatively connecting the one or more gas delivery members to one or more gas supplies;

administering a negative charge to a cathode assembly including a target having one or more target materials and a positive charge to the gas delivery system using one or more power sources to generate a sputtering plasma for applying target material from said target to a substrate.

30. The method of maintaining a conductive anodic surface of claim 29 wherein the one or more power sources are directly connected to the one or more gas delivery members to deliver a positive charge to said one or more gas delivery members.

31. The method of maintaining a conductive anodic surface of claim 29 wherein the gas distribution system further includes one or more inner conduits positioned within the one or more gas delivery members.

32. The method of maintaining a conductive anodic surface of claim 31 wherein the one or more inner conduits include a plurality of apertures that are spaced and aligned in a non-overlapping manner relative to the nozzles.

33. The method of maintaining a conductive anodic surface of claim 29 wherein the one or more power sources are operatively connected to one or more conductive members that are attached to the one or more gas delivery members.

34. The method of maintaining a conductive anodic surface of claim 33 wherein the one or more conductive members are attached to the one or more gas delivery members by non-conductive brackets.

35. The method of maintaining a conducting anodic surface of claim 33 wherein the one or more conductive members are conductive wires.

49. The method of maintaining a conductive anodic surface of claim 29 wherein an insulator is interposed between the one or more gas supplies and the one or more gas delivery members.

36. A method of maintaining a stable plasma in a magnetron sputtering system comprising the steps of:

introducing one or more sputtering gases through a gas delivery system and into a deposition chamber, the gas delivery system including one or more gas delivery members each being hollow and each having nozzles through which the one or more sputtering gases are introduced into the deposition chamber;

administering a negative charge to a cathode assembly and a positive charge to the gas delivery system using one or more power sources; and

maintaining the conductive capacity of the gas delivery system through the cleaning action of the plasma flame and/or directed gas flow.

37. The method of maintaining a stable plasma of claim 36 wherein the gas delivery system includes one or more gas conduits operatively connecting the one or more gas delivery members to one or more gas supplies.

38. The method of maintaining a stable plasma of claim 37 wherein the one or more power sources are directly connected to the one or more gas conduits or the one or more gas delivery members to deliver a positive charge to said one or more gas delivery members.

39. The method of maintaining a stable plasma of claim 36 wherein the gas distribution system further comprises one or more inner conduits positioned within the one or more gas delivery members.

40. The method of maintaining a stable plasma of claim 39 wherein the one or more inner conduits include a plurality of apertures that are spaced and aligned in a non-overlapping manner relative to the nozzles.

41. The method of maintaining a stable plasma of claim 36 wherein the one or more power sources is operatively connected to one or more conductive members that are positioned adjacent to the gas delivery members.

42. The method of maintaining a stable plasma of claim 41 wherein the one or more conductive members are attached to the one or more gas delivery members by brackets.

43. The method of maintaining a stable plasma of claim 41 wherein the one or more conductive members include one or more conductive wires.

44. The method of maintaining a stable plasma of claim 36 wherein the nozzles face away from cathode assemblies.

45. The method of maintaining a stable plasma of claim 37 wherein an insulator is interposed between the one or more gas supplies and the one or more gas delivery members.

46. The method of maintaining a stable plasma of claim 37 wherein a plurality of independent gas lines including gas flow controllers operably connect the one or more gas delivery members to the one or more gas supplies.

47. The method of maintaining a stable plasma of claim 46 wherein the one or more gas delivery members include one or more partitions to contain the flow of gas from the independent gas lines in predesignated portions of the one or more gas delivery members.

48. The anodic gas delivery system of claim 42, wherein the one or more brackets operably adjoined to the one or more conductive members is made from a nonconductive material.