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Magnetron sputtering systems including anodic gas distribution systems

  • US 7,166,199 B2
  • Filed: 12/18/2002
  • Issued: 01/23/2007
  • Est. Priority Date: 12/18/2002
  • Status: Active Grant
First Claim
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1. A magnetron sputtering apparatus for applying thin films on substrates, comprising:

  • a vacuum chamber within which a controlled environment may be established;

    one or more cathode assemblies including a target comprising one or more sputterable target materials;

    a gas distribution system operatively connected to one or more gas supplies and including one or more gas delivery members each being hollow and each having nozzles through which sputtering gases are introduced into the vacuum chamber;

    and one or more power supplies electrically connected to the one or more cathode assemblies and the gas distribution system.

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