Method and apparatus for an improved upper electrode plate in a plasma processing system

• US 7,166,200 B2
• Filed: 09/30/2002
• Issued: 01/23/2007
• Est. Priority Date: 09/30/2002
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Nakayama, Hiroyuki, Mitsuhashi, Kouji, Takase, Taira, Saigusa, Hidehito
• Primary Examiner(s): Lee; Wilson
• Application Number:
  US10/259,757
• Publication Number:
  US 20040061447A1
• Time in Patent Office: 1,576 Days
• Field of Search: 315/111.21, 315/111.81, 315/111.91, 315/111.41, 315/111.51, 315/111.61, 315/111.71, 118/723.MW, 118/723.ME, 118/69, 156/345.14, 156/345.33, 156/345.34, 156/345.41, 204/298.01, 204/298.02, 204/298.14
• US Class Current: 204/298.01
• CPC Class Codes: H01J 37/32009 Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources plasma generation in general H05H1/24
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/3255 Material

Abstract

The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.

Claims

1. An upper electrode for a plasma processing system comprising:

an electrode plate comprising a first surface for coupling said electrode plate to an upper assembly, a second surface comprising a plasma surface configured to face a processing space in said plasma processing system and a mating surface for mating said electrode plate with said plasma processing system, a peripheral edge, and one or more gas injection orifices coupled to said first surface and said second surface and configured to couple a processing gas to said processing space;

a protective barrier coupled to a plurality of exposed surfaces of said electrode plate, said exposed surfaces comprising said plasma surface and said protective barrier being a coating which comprises Yttria; and

a diagnostics port comprising an entrant cavity, and an exit through-hole, wherein said exit through-hole comprises an interior surface, wherein said exposed surfaces further comprise said interior surface of said diagnostics port.

2. The upper electrode of claim 1, wherein:

said mating surface comprises a first substantially planar surface extending radially inward from said peripheral edge; and

said plasma surface comprises a second substantially planar surface radially and axially spaced from said first substantially planar surface, said second substantially planar surface having said one or more gas injection orifices formed therein.

3. The upper electrode of claim 2, wherein said protective barrier is provided on said second substantially planar surface and extends from a center of the upper electrode radially outward, said protective barrier terminating at a location radially between an outer periphery of said first substantially, planar surface and an outer periphery of said second substantially planar surface.

4. The upper electrode of claim 3, wherein said protective barrier is provided only on bare surfaces of the electrode plate not having an anodization layer thereon.

11. The upper electrode of claim 1O, wherein at least one of a first transition from the second substantially planar surface to the first sidewall, a second transition from the first sidewall to the third substantially planar surface, and a third transition from the third substantially planar surface to said second sidewall is rounded.

12. The upper electrode of claim 1, wherein said protective barrier comprises a spray coating.

13. The upper electrode of claim 1, wherein said protective barrier is provided in direct contact with a bare surface of said electrode plate, said bare surface not having an anodization layer thereon.

14. The upper electrode of claim 1, wherein each of said plasma surface and said interior surface of the diagnostics port is a bare surface not having an anodization layer thereon, and said protective barrier is provided in direct contact with said bare surface.

15. The upper electrode of claim 1, further comprising:

a plenum cavity formed in and substantially centered on said first surface of the electrode plate; and

a plurality of fastening receptors formed in said first surface and circumferentially spaced around said plenum cavity, wherein said diagnostic port is radially positioned between the fastening receptors and the peripheral edge of said electrode plate.

16. The upper electrode of claim 15, wherein said diagnostics port comprises:

a diagnostic port recess in said first surface, and

said entrant cavity opening to said diagnostic port recess and said exit through-hole opening to said second surface.

17. The upper electrode of claim 16, wherein said protective barrier is provided on at least a portion of said diagnostics port.

18. The upper electrode of claim 17, wherein said portion of said diagnostics port is a bare surface not having an anodization layer thereon.

19. The upper electrode of claim 14, wherein said protective baffler is provided on only a portion of said diagnostics port.

20. The upper electrode of claim 16, wherein:

said entrant cavity comprises a tapered opening,

said protective baffler is provided on only a portion of said tapered opening adjacent to said exit through hole, and

said protective baffler is not provided on a remaining portion of said tapered opening adjacent to said diagnostic port recess, and is not provided on said diagnostic port recess.

21. The upper electrode of claim 15, further comprising a sealing feature configured to seal said diagnostics port when said electrode plate is coupled to said upper assembly.

22. The upper electrode of claim 21, wherein said sealing feature comprises a bare metal not having said protective baffler or an anodization layer provided thereon.

23. The upper electrode of claim 1, wherein:

a first portion of said upper electrode has an anodization layer provided thereon; and

a second portion of said upper electrode does not have said anodization layer thereon and does not include said protective baffler thereon.

24. The upper electrode of claim 23, wherein said first portion comprises at least one of said mating surface and said peripheral edge.

25. The upper electrode of claim 23, wherein said second portion comprises at least part of said first surface.

26. The upper electrode of claim 23, wherein said second portion comprises said mating surface.

27. The upper electrode of claim 1, wherein at least part of said first surface does not have said coating thereon.

28. The upper electrode of claim 27, wherein said coating is a spray coating.

29. The upper electrode of claim 1, wherein said coating is not provided on said first surface.

30. The upper electrode of claim 1, whercin said first surface comprises:

a plenum cavity formed substantially in a center of said first surface; and

a coupling surface extending radially outward from an edge of said plenum cavity, wherein;

a surface of said plenum cavity has an anodization layer provided thereon, and

said coupling surface does not have said anodization layer provided thereon

and does not have said protective barrier provided thereon.

31. The upper electrode of claim 30, wherein said plenum cavity comprises a plenum surface having said one or more gas injection orifices formed therein such that said plenum cavity receives said processing gas and distributes said processing gas to said one or more gas injection orifices.

32. The upper electrode of claim 31, wherein said one or more gas injection orifices comprises a plurality of gas injection orifices each comprising:

an entrant region that opens to said plenum surface;

an exit region that opens to said second surface, wherein;

said entrant region has a larger diameter than said exit region,

said gas injection orifice further comprising a tapered transition that couples

said entrant region to said exit region, and

said protective barrier is provided on at least a portion of said gas injection

orifice.

33. The upper electrode of claim 32, wherein said portion of said gas injection orifice is a bare surface not having an anodization layer thereon.

34. The upper electrode of claim 32, wherein said protective barrier is provided on only a portion of said gas injection orifice.

35. The upper electrode of claim 33, wherein at least part of said first surface does not include said protective barrier.

5. The upper electrode of c1aim 2, wherein said plasma surface further comprises a recess recessed from said first substantially planar surface and radially positioned between said first substantially planar surface and said second substantially planar surface.

6. The upper electrode of claim 5, wherein said protective barrier is provided on at least a portion of said recess.

7. The upper electrode of claim 5, wherein said protective barrier is provided on only a portion of said recess.

8. The upper electrode of claim 5, wherein:

said plasma surface further comprises a third substantially planar surface radially positioned between said first substantially planar surface and said second substantially planar surface, said third substantially planar surface also being axially positioned between said first substantially planar surface of the mating surface and said second substantially planar surface of the plasma surface; and

wherein said recess compnses;

a first recess surface recessed from said first substantially planar surface, and

a second recess surface recessed from said first recess surface and radially

positioned between said first recess surface and said second substantially planar surface.

9. The upper electrode of claim 8, wherein said protective barrier is provided on said second substantially planar surface, said third substantially planar surface, said second recess surface, and a portion of said first recess surface, said protective barrier terminating at a location between said first recess surface and said first substantially planar surface of the mating surface.

10. The upper electrode of claim 9, wherein:

said second substantially planar surface is coupled to said third substantially planar surface by a first sidewall which is substantially at a right angle to said second and third substantially planar surfaces, and said third substantially planar surface is coupled to said second recess surface by a second sidewall which is substantially at a right angle to said third substantially planar surface and said second recess surface.

36. An upper electrode for a plasma processing system comprising:

an electrode plate comprising a first surface for coupling said electrode plate to an upper assembly, a second surface comprising a plasma surface configured to face a processing space in said plasma processing system and a mating surface for mating said electrode plate with said olasma processing system, a peripheral edge. and one or more gas injection orifices coupled to said first surface and said second surface and configured to couple a processing gas to said processing space; and

a protective barrier provided on a plurality of exposed surfaces of said electrode plate, said exposed surfaces comprising said plasma surface, wherein said protective barrier is a coating which comprises Yttria, wherein said first surface comprises;

a plenum recess formed substantially in a center of the first surface to form a plenum cavity that receives said processing gas and distributes said processing gas to said one or more gas injection orifices formed within the plenum recess in the first surface;

a coupling surface extending radially outward from an edge of said plenum recess;

a sealing feature formed in the coupling surface and surrounding said plenum recess; and

a plurality of fastening receptors radially positioned between said sealing feature and said peripheral edge.

37. The upper electrode of claim 36, wherein:

said plenum recess has an anodization layer formed thereon; and

said coupling surface does not have said anodization layer formed thereon and does not have said protective baffler provided thereon.

38. The upper electrode of claim 37, wherein said sealing feature does not have said anodization layer formed thereon and does not have said protective baffler provided thereon.

39. The upper electrode of claim 37, wherein said plurality of fastening receptors are circumferentially spaced around said sealing feature, wherein said anodization layer is provided on at least a portion of an interior of each of said fastening receptors.

40. The upper electrode of claim 37, wherein said plurality of fastening receptors are circumferentially spaced around said sealing feature, said upper electrode further comprising a diagnostic port extending from said first surface to said second surface, said diagnostic port being positioned radially outward of said circumferentially spaced fastening receptors.

41. The upper electrode of claim 40, further comprising alignment features opening to said first surface and being positioned on symmetrically opposing sides of said diagnostic port.

42. The upper electrode of claim 41, further comprising another sealing feature surrounding said diagnostic port, wherein said another sealing feature does not have said anodization layer provided thereon and does not have said protective barrier provided thereon.

43. An upper electrode for a plasma processing system comprising:

an electrode elate comprising a first surface for coupling said electrode elate to an upper assembly, a second surface comprising a plasma surface configured to face a processing space in said plasma processing system and a mating surface for mating said electrode plate with said plasma processing system, a peripheral edge, and one or more as injection orifices couvled to said first surface and said second surface and configured to couple a processing gas to said processing space; and

a protective barrier provided on a plurality of exposed surfaces of said electrode plate. said exposed surfaces comprising said plasma surface, wherein said protective barrier is a coating which comprises Yttria wherein;

said mating surface comprises a first substantially planar surface extending radially inward from said peripheral edge; and

said plasma surface compnses a second substantially planar surface radially and axially spaced from said first substantially planar surface, said second substantially planar surface having said one or more gas injection orifices formed therein.

44. The upper electrode of claim 43, wherein said protective barrier is provided on said second substantially planar surface and extends from a center of the upper electrode radially outward, said protective barrier terminating at a location radially between an outer periphery of said first substantially planar surface and an outer periphery of said second substantially planar surface.

45. The upper electrode of claim 44, wherein said protective barrier is provided only on bare surfaces of the electrode plate not having an anodization layer thereon.

46. The upper electrode of claim 43, wherein said plasma surface further comprises a recess recessed from said first substantially planar surface and radially positioned between said first substantially planar surface and said second substantially planar surface.

47. The upper electrode of claim 46, wherein said protective barrier is provided on at least a portion of said recess.

48. The upper electrode of claim 46, wherein said protective barrier is provided on only a portion of said recess.

49. The upper electrode of claim 46, wherein:

said plasma surface further comprises a third substantially planar surface radially positioned between said first substantially planar surface and said second substantially planar surface, said third substantially planar surface also being axially positioned between said first substantially planar surface of the mating surface and said second substantially planar surface of the plasma surface; and

said recess comprises;

a first recess surface recessed from said first substantially planar surface, and

a second recess surface recessed from said first recess surface and radially positioned between said first recess surface and said second substantially planar surface.

50. The upper electrode of claim 49, wherein said protective barrier is provided on said second substantially planar surface of said plasma surface, said third substantially planar surface of said plasma surface, said second recess surface of said plasma surface, and a portion of said first recess surface of said plasma surface, said protective barrier terminating at a location between said first recess surface and said first substantially planar surface of said mating surface.

51. An upper electrode for a plasma processing system comprising:

an electrode plate comprising a first surface for coupling said electrode plate to an upper assembly, a second surface comprising a plasma surface configured to face a processing space in said plasma processing system and a mating surface for mating said electrode plate with said plasma processing system, a peripheral edge, and one or more gas injection orifices coupled to said first surface and said second surface and configured to couple a processing gas to said processing space; and

a protective barrier provided on a plurality of exposed surfaces of said electrode plate, said exposed surfaces comprising said plasma surface, wherein said protective barrier is a coating which comprises Yttria, wherein said first surface comprises;

a plenum cavity formed substantially in a center of said first surface; and

a coupling surface extending radially outward from an edge of said plenum cavity, wherein;

a surface of said plenum cavity has an anodization layer provided thereon, and

said coupling surface does not have said anodization layer provided thereon

and does not have said protective barrier provided thereon.

52. The upper electrode of claim 51, wherein said plenum cavity comprises a plenum surface having said one or more gas injection orifices formed therein such that said plenum cavity receives said processing gas and distributes said processing gas to said one or more gas injection orifices.

53. The upper electrode of claim 52, wherein said one or more gas injection orifices comprises a plurality of gas injection orifices each comprising:

an entrant region that opens to said plenum surface;

an exit region that opens to said second surface, wherein;

said entrant region has a larger diameter than said exit region,

said gas injection orifice further comprising a tapered transition that couples

said entrant region to said exit region, and

said protective barrier is provided on at least a portion of said gas injection

orifice.

54. The upper electrode of claim 53, wherein said portion of said gas injection orifice is a bare surface not having an anodization layer thereon.

55. The upper electrode of claim 53, wherein said protective barrier is provided on only a portion of said gas injection orifice.

56. The upper electrode of claim 55, wherein at least part of said first surface does not include said protective barrier.