VLSI fabrication processes for introducing pores into dielectric materials
First Claim
Patent Images
1. A method of forming a layer comprising conductive lines on a substrate, the method comprising:
- (a) providing a layer of composite dielectric material on the substrate, wherein the composite dielectric material comprises a dielectric network and a porogen;
(b) treating the dielectric network in a manner that shrinks and/or strengthens the layer of dielectric material;
(c) patterning the layer of composite dielectric material to define paths for the conductive lines;
(d) filling the paths with conductive material; and
(e) after filling the paths in (d), removing at least some of the porogen from the layer of composite dielectric material to produce a porous dielectric network.
1 Assignment
0 Petitions
Accused Products
Abstract
Porous dielectric layers are produced by introducing pores in pre-formed composite dielectric layers. The pores may be produced after the barrier material, the metal or other conductive material is deposited to form a metallization layer. In this manner, the conductive material is provided with a relatively smooth continuous surface on which to deposit.
231 Citations
36 Claims
-
1. A method of forming a layer comprising conductive lines on a substrate, the method comprising:
-
(a) providing a layer of composite dielectric material on the substrate, wherein the composite dielectric material comprises a dielectric network and a porogen; (b) treating the dielectric network in a manner that shrinks and/or strengthens the layer of dielectric material; (c) patterning the layer of composite dielectric material to define paths for the conductive lines; (d) filling the paths with conductive material; and (e) after filling the paths in (d), removing at least some of the porogen from the layer of composite dielectric material to produce a porous dielectric network. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A method of forming a layer comprising conductive lines on a substrate, the method comprising:
-
(a) forming a layer of porous dielectric material on the substrate, wherein the porous dielectric material comprises voids; (b) filling at least some voids in the dielectric material with a sealant; (c) patterning the layer of composite dielectric material to define paths for the conductive lines; (d) filling the paths with conductive material; and (e) after filling the paths in (d), removing at least some of the sealant from the dielectric material. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A method of forming a layer comprising conductive lines on a substrate, the method comprising:
-
(a) directly depositing a dielectric layer comprising a dielectric network on the substrate, without curing or polymerizing the as deposited dielectric material; (b) treating the dielectric network in a manner that shrinks and/or strengthens the layer of dielectric material; (c) patterning the dielectric layer to define paths for the conductive lines; (d) filling the paths with conductive material; and (e) after filling the paths in (d), removing porogen from the dielectric layer to produce a porous dielectric network. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
-
Specification